Automatic punching method based on through holes

Abstract

The invention discloses an automatic punching method based on through holes. The automatic punching method comprises the following steps: selecting a first metal layer and a third metal layer to be punched in a chip physical layout; Wherein the first metal layer and the third metal layer comprise two cross-layered metal layers and two adjacent metal layers; When a configured punching trigger signal is detected, defining the size and spacing information of a through hole device to be called; Meanwhile, obtaining the size of a metal overlapping region of the first metal layer and the third metallayer; calculating the number of through hole devices to be called according to the size of the metal overlapping area, the size of the through hole devices and the spacing information of the throughhole devices; Whether the number of the through hole devices is smaller than or equal to 1 or not is judged, if yes, the punching devices with the through hole number being 3 are called, and a punching function is called for punching operation; otherwise, the punching function is directly called to carry out punching operation. According to the invention, cross-layer automatic punching and redundant hole insertion are realized through one punching trigger signal.

Description

technical field [0001] The invention relates to a method for optimizing the physical layout of a semiconductor chip, in particular to an automatic drilling method based on through holes. Background technique [0002] With the rapid development of integrated circuits, more and more layers of metal interconnection lines are used on the chip. The increase in design scale and design complexity increases the complexity of wiring. As a connection medium between metal interconnection lines, through holes play an extremely important role in the design of integrated circuit chips. The number of through holes will cause changes in the resistance of the line, resulting in a shift in the line voltage, thereby affecting the performance of the chip. The overcurrent capability of the through holes will affect the large current transmission of the line. When the number of through holes is not enough to withstand the large current, the failure of the through holes will be caused. During c...

AI Technical Summary

Problems solved by technology

Since this punching behavior can only realize automatic punching between two adjacent metal layers, it cannot achieve cross-layer punching, and the number of punching holes will change with the size of the overlapping area of ​​the selected metal layer. Therefore, the number of automatic punching holes in places where the overlapping area is small is only 1

For a layout structure with only a single through hole but still enough space to establish metal wiring connections, it will not only cause a large parasitic resistance in the circuit, but may also cause the failure of the through hole due to manufacturing reasons, resulting in the failure of the chip function

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