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Die attaching apparatus and method for manufacturing semiconductor device

A chip-mounting, bare-chip technology, applied in semiconductor/solid-state device manufacturing, electrical components, circuits, etc., to solve problems such as increased mechanical load, device failure, and defective products

Active Publication Date: 2022-03-29
FASFORD TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

On the other hand, the chip mounter operates the pick-up head and the placement head at high speed in order to improve productivity. Therefore, the risk of device failure and defective products due to increased mechanical load and vibration increases.
[0009] However, there is currently a problem that there is no mechanism to detect abnormalities in advance by accurately grasping the movement trajectory and vibration of the placement head, etc. during the operation of the device

Method used

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  • Die attaching apparatus and method for manufacturing semiconductor device
  • Die attaching apparatus and method for manufacturing semiconductor device
  • Die attaching apparatus and method for manufacturing semiconductor device

Examples

Experimental program
Comparison scheme
Effect test

Deformed example 1

[0108] Figure 17 is to indicate Figure 10 The graph of the acceleration waveform, velocity and position in the state of , Figure 17 (A) is a graph showing the acceleration waveform in the Y direction, Figure 17 (B) is to indicate that Figure 17 The graph of the velocity waveform in the Y direction obtained by integrating the waveform of (A), Figure 17 (C) is to indicate that Figure 17 Figure of the position waveform in the Y direction obtained by integrating the waveform of (B).

[0109] In the above-mentioned (a2), when the mounting head 41 is driven in the Y direction, the vibration displacement in the Y direction is obtained from the difference between the acceleration signal waveform obtained from the gyro sensor 45 and the command acceleration waveform. In Example 1, it is obtained from the difference between the movement trajectory of the placement head 41 and the command position waveform.

[0110] (b1) The operation abnormality diagnosis unit 214 obtains t...

Deformed example 2

[0116] Figure 18 It is a figure which shows the attachment position of the gyro sensor of the modification 2.

[0117] In the embodiment, the case where the gyro sensor 45 is provided in the vicinity of the center O of the placement head 41 near the intersection of the drive axes that drive the placement head 41 in the X, Y, and Z directions has been described. It is not limited to this, It can be installed in the place where the sensor can be mounted between the top end of the collet 42 of the mounting head 41 and the upper end of the mounting head 41.

[0118] like Figure 18 As shown, when the gyro sensor 45 is provided at the tip of the collet 42 of the placement head 41 or in the vicinity of the tip of the collet 42, the vibration affecting the placement accuracy can be directly grasped.

[0119] In Modification 2, the 6-axis gyro sensor is provided at or near the top of the collet of the placement head. As a result, the vibration that affects the placement accuracy (...

Deformed example 3

[0128] Figure 19 It is a figure which shows the abnormality determination method of the modification 3. FIG. exist Figure 19 For ease of illustration, the composite waveform of the vibration displacement in the X direction and the vibration displacement in the Y direction when the mounting head 41 is driven in the Y direction is shown.

[0129] In the embodiment and Modifications 1 and 2, the abnormality diagnosis is performed with a single threshold for the maximum displacement of the composite waveform. However, a method may be adopted in which the locus and the X-axis of the vibration displacement in the standard XYZ directions measured a plurality of times may be used. When the trajectory of the vibration displacement in the Y-axis Z-axis rotation direction is separated by a certain distance, it is determined as abnormal. In this method, it is not necessary to obtain the maximum displacement from the synthesized waveform. When this is applied to the Example, it is as ...

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Abstract

The present invention provides a die mounting apparatus including a mechanism for detecting abnormality of a mounting head and the like. The chip attaching apparatus includes: a bare chip supply part; a substrate supply part; a bare chip on the substrate; and a control unit that controls the bare chip supply unit, the substrate supply unit, and the placement unit. The placement unit includes: a placement head with a collet that absorbs the bare chip; a drive unit that includes a drive shaft that moves the placement head; and a sensor that can detect the position of the placement head. angular velocity and acceleration. The control unit compares the vibration displacement with a preset threshold value of the vibration displacement using the result obtained by the sensor to determine abnormality.

Description

technical field [0001] The present invention relates to a chip mounter, and can be applied to a chip mounter including, for example, a gyro sensor. Background technique [0002] In a part of the manufacturing process of a semiconductor device, there is a process of assembling a package by mounting a semiconductor chip (hereinafter, simply referred to as a die.) on a wiring board, a lead frame, etc. (hereinafter, abbreviated as a substrate). In the process of assembling the package, there are a process of dividing a bare chip from a semiconductor wafer (hereinafter simply referred to as a wafer) and a mounting process of mounting the divided bare chip on a substrate. The manufacturing apparatus used in the mounting process is a die attach apparatus such as a die bonder. [0003] A die mounter is a device for mounting (mounting and bonding) a bare chip on a substrate or a mounted bare chip using solder, a plating material, and a resin as a bonding material. In a die mounter ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/67H01L21/02
CPCH01L21/02H01L21/67011H01L21/67126H01L21/67155H01L21/67242H01L21/67253H01L21/67144H01L21/67092H01L21/67712H01L21/67259H01L21/52
Inventor 楯充明
Owner FASFORD TECH
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