A manufacturing process of a microchip transfer nozzle
A chip transfer and manufacturing process technology, which is applied to the process for producing decorative surface effects, manufacturing microstructure devices, metal material coating processes, etc., can solve the problems of limiting the miniaturization of microarray chips, achieve simple structure, improve The effect of transferring efficiency, saving production time and cost
Active Publication Date: 2020-11-20
CHANGCHUN INST OF OPTICS FINE MECHANICS & PHYSICS CHINESE ACAD OF SCI
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Problems solved by technology
[0002] At present, the miniaturization and integration of micro-array devices (micro LED arrays, MEMS lighting, etc.) in integrated circuit packaging is further miniaturized and integrated. The transfer of chips is the most important link in the integrated circuit packaging process. The chip transfer of traditional array devices mainly uses Chip on Board (COB) process, COB technology uses a high-precision placement machine to achieve chip-to-substrate transfer, limited by the size of the transfer nozzle of the die-bonding machine, usually the minimum size of the transferable chip is about 100 μm, which limits the further miniaturization of the micro-array chip change
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[0033] In order to enable those skilled in the art to better understand the technical solution of the present invention, the present invention will be further described in detail below in conjunction with the accompanying drawings.
[0034] see figure 1 shown;
[0035] A microchip transfer nozzle of the present invention comprises:
[0036] The base 10 has a base air hole 11 at one end for communicating with the air hole 17 of the vacuum chuck 15, the other end of the base 10 has a sealing layer 14 in contact with the chip, and the base 10 is located on the surface of the base air hole 11 end It is fixedly connected with the vacuum suction cup 15 through a sealant;
[0037] The boss 12 is fixedly connected to the side of the base 10 away from the air guide hole 11 of the base, and the sealing layer 14 is fixedly connected to the upper surface of the boss 12. Connected boss air hole 13.
[0038] Preferably, the horizontal section of the boss 12 is circular, and its outer di...
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Abstract
The invention discloses a manufacturing process of a microchip transfer suction nozzle, which belongs to the technical field of microarray device production and is used to solve the problem of microchip transfer preparation in the range of 5-100 μm. The invention is provided with a base, one end of which has a The base air hole is used to communicate with the air hole of the vacuum chuck. The other end of the base has a sealing layer in contact with the chip. The surface of the base at the end of the base air hole is connected to the vacuum chuck through a sealant Fixed connection; the boss, which is fixed on the side of the base away from the air guide hole of the base, the sealing layer is fixed on the upper surface of the boss, and the boss has a , and the air guide hole of the boss connected with the air guide hole of the base, the present invention has the characteristics of high transfer efficiency, simple structure and easy preparation.
Description
technical field [0001] The invention relates to the technical field of manufacturing microarray devices, in particular to a manufacturing process of a microchip transfer suction nozzle. Background technique [0002] At present, the miniaturization and integration of micro-array devices (micro-LED arrays, MEMS, etc.) in integrated circuit packaging is further miniaturized and integrated. The transfer of chips is the most important link in the integrated circuit packaging process. The chip transfer of traditional array devices mainly uses Chip on Board (COB) process, COB technology uses a high-precision placement machine to realize the transfer of the chip to the substrate, limited by the size of the transfer nozzle of the die-bonding machine, usually the minimum size of the transferable chip is about 100 μm, which limits the further miniaturization of the micro-array chip change. [0003] In recent years, in order to realize the transfer of smaller-sized chips (5-100μm), res...
Claims
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IPC IPC(8): H01L21/683B81C1/00
CPCB81C1/00261H01L21/6838
Inventor 陶金梁静秋梁中翥王惟彪孟德佳吕金光秦余欣李阳王家先赵永周
Owner CHANGCHUN INST OF OPTICS FINE MECHANICS & PHYSICS CHINESE ACAD OF SCI