a printed circuit board
A printed circuit board, one-sided technology, applied in the direction of printed circuit, printed circuit, printed circuit parts, etc., can solve the problems of difficulty in adapting to the thickness of the whole plate, large size of printed circuit board, etc., achieve good grounding and heat dissipation, reduce area, The effect of downsizing
Active Publication Date: 2022-03-01
SHANGHAI LOVDREAM COMM TECH
View PDF4 Cites 0 Cited by
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
[0003] According to the above-mentioned problems in the prior art, a printed circuit board is now provided, which aims to overcome the increasing size of the printed circuit board caused by the existing design method, and the thickness of the whole plate after assembly is difficult to meet the requirements of modern electronic products The problem
Method used
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View moreImage
Smart Image Click on the blue labels to locate them in the text.
Smart ImageViewing Examples
Examples
Experimental program
Comparison scheme
Effect test
Embodiment Construction
[0036] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without creative efforts fall within the protection scope of the present invention.
[0037] It should be noted that, in the case of no conflict, the embodiments of the present invention and the features in the embodiments can be combined with each other.
[0038] The present invention will be further described below in conjunction with the accompanying drawings and specific embodiments, but not as a limitation of the present invention.
[0039] In a preferred embodiment of the present invention, based on the above-mentioned problems in the prior ar...
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More PUM
Login to View More Abstract
The invention discloses a printed circuit board, which relates to the technical field of integrated circuits; several components are arranged on both sides of the printed circuit board, and the components include a main CPU chip and a storage chip, which are respectively arranged on both sides of the printed circuit board. The main CPU chip and the storage chip are partially or completely overlapped and electrically connected. The beneficial effect of the above technical solution is: by placing components on both sides of the printed circuit board, the size of the circuit module and the thickness of the entire board after assembly are greatly reduced, making it more flexible to apply to more and wider electronic products In addition, because the area of the printed circuit board is greatly reduced, production and manufacturing costs are reduced; in addition, the main CPU chip and the memory chip are partially or completely overlapped and placed on two sides, which greatly shortens the connection between the CPU and the memory chip. The length of the wire improves the accuracy, reliability and stability of the electronic signal.
Description
technical field [0001] The invention relates to the technical field of integrated circuits, in particular to a printed circuit board. Background technique [0002] The printed circuit board is an important electronic component, a support for electronic components and a carrier for electrical connections of electronic components. In the prior art, when designing a printed circuit board for a circuit module, components are generally placed on one side, and the distance between components is relatively large. Although the printed circuit board design of electronic products is getting smaller and thinner, the functions are becoming more and more complex, and more and more components are required. Therefore, if you continue to design circuit module printed circuit boards according to the traditional way of placing components on one side and the distance between each component is large, the size of the printed circuit board will become larger and larger, resulting in more and mor...
Claims
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More Application Information
Patent Timeline
Login to View More Patent Type & Authority Patents(China)
IPC IPC(8): H05K1/18H05K1/11
CPCH05K1/116H05K1/182H05K2201/09409H05K2201/10159
Inventor 邓矣兵
Owner SHANGHAI LOVDREAM COMM TECH