Full-automatic single-rail glue dispenser and glue dispensing process thereof

Abstract

The invention discloses a full-automatic single-rail glue dispenser and a glue dispensing process thereof. The full-automatic single-rail glue dispenser comprises two sets of collection and release assemblies, a conveying rail, a front pushing part, a glue dispensing platform and a glue dispensing assembly. The two collection and release assemblies are arranged on the left and right sides of a rack correspondingly symmetrically. The front pushing part is arranged on the lateral part of the collection and release assembly on the left side and pushes carrier plates in the collection and releaseassembly on the left side into the conveying rail. The conveying rail is arranged between the two collection and release assemblies. A rear pushing part of the conveying rail pushes the carrier platesinto the collection and release assembly on the right side. The glue dispensing platform is arranged between a movable support plate and a fixed support plate, conducts upward jacking and supports the carrier plates. The glue dispensing assembly is arranged above the glue dispensing platform and conducts glue dispensing on the carrier plates on the glue dispensing platform. Through the full-automatic single-rail glue dispenser and the glue dispensing process thereof, mutual friction and collision between adjacent carrier plates are avoided effectively, position stability of fingerprint modules on the carrier plates is ensured while feed and discharge efficiency is promoted in a linear pushing mode, and adjustability of the sizes of the conveying carrier plates is achieved.

Description

technical field [0001] The invention relates to the field of mechanical automation, in particular to a fully automatic monorail glue dispensing machine and a glue dispensing process thereof. Background technique [0002] In recent years, smart phone technology has developed rapidly, and various new technologies have been continuously applied in the manufacturing process of smart phones, such as the fingerprint recognition boot technology that appears in domestic mobile phones. The hardware and software foundation of fingerprint recognition technology is fingerprint modules. In the process of mobile phone production and assembly, the bottom of the FPC+IC product for the fingerprint module needs to be filled with glue, so that the FPC+IC of the fingerprint module can be fixed on the carrier board; in the process of solving the problem of fingerprint module dispensing automation and productivity improvement Among them, there are the following key technical problems that need to...

AI Technical Summary

Problems solved by technology

[0002] In recent years, smart phone technology has developed rapidly, and various new technologies have been continuously applied in the manufacturing process of smart phones, such as the fingerprint recognition boot technology that appears in domestic mobile phones. The hardware and software foundation of fingerprint recognition technology is fingerprint modules. In the process of mobile phone production and assembly, the bottom of the FPC+IC product for the fingerprint module needs to be filled with glue, so that the FPC+IC of the fingerprint module can be fixed on the carrier board; in the process of solving the problem of fingerprint module dispensing automation and productivity improvement Among them, there are the following key technical problems that need to be solved: 1. Since modern industrial production mostly adopts the automatic production line mode, this production mode can complete the processing of various processes for the continuous flow of concentrated and large-scale products, while the loading and unloading of the existing carrier board The material method is generally completed by using a robot to move the carrier board out or put it into the material box. In this loading and unloading method, the carrier board is directly stacked in the material box, and the adjacent carrier boards will wear and collide with each other during storage and transportation, resulting in The carrier board or fingerprint module is damaged, especially for the fingerprint module before dispensing, it is placed on the carrier board, but it is not fixed with the carrier board, so it is very easy to cause the position of the fingerprint module on the carrier board to be damaged during the removal process. Offset, which affects the assembly accuracy; 2. When the traditional manipulator loads and unloads the carrier board by adsorption or clamping, the path of the carrier board is to rise along the vertical direction first, then move along the horizontal linear direction, and then move along the vertical direction. The moving path of the carrier board is long, which limits the improvement of the loading and unloading efficiency of the carrier board, and the position of the fingerprint module is likely to shift during the lifting process of the carrier board, resulting in an increase in the rate of assembly defective products; and the loading and unloading path is too long. 3. During the straight-line transportation of the carrier board on the two timing belts set at parallel intervals, the distance between the two timing belts cannot be adjusted, so only fixed-sized loads can be transported. board, poor transmission versatility

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