Semiconductor wafer precision cutting device

Abstract

The invention relates to the technical field of cutting equipment, in particular to a semiconductor wafer precision cutting device. The semiconductor wafer precision cutting device includes support rods, a fixing device, a fixed seat and a cutter head. The support rods are arranged on the two sides of the top of the fixed seat. A first motor is arranged on the left side of the top of the left support rod. A screw rod is arranged on the lower side of the first motor. A first fixing block is arranged on the outer side of the part of the screw rod between the two support rods. A telescopic rod isarranged at the bottom of the first fixing block. The cutter head is arranged at the bottom of the telescopic rod. Light sources are arranged on the two sides of the cutter head. A light source sensor is arranged at the lower end of the cutter head. The fixing device is arranged on the lower side of the cutter head. Through the setting of the fixing device, a wafer can be well fixed, cutting failure due to side slip of wafers in the cutting process is avoided, and the cutting accuracy is improved. Through the setting of the light source sensor, the precision of cutting can be improved, and the quality of cutting can be improved.

Description

technical field [0001] The invention relates to the technical field of cutting equipment, in particular to a semiconductor wafer precision cutting device. Background technique [0002] Wafer (Wafer) refers to the silicon wafer used in the production of silicon semiconductor integrated circuits. Because of its circular shape, it is called a wafer. In the production and application of semiconductors, wafer cutting is essential, and the cutting of semiconductor wafers The quality directly determines whether the semiconductor is qualified. [0003] At present, in the cutting technology on the market, laser cutting is mostly used. Although the cutting effect is good and the process is good, heat is generated, which is easy to cause wafer deformation. At the same time, the heat-affected zone is also easy to cause circuit rust, which in turn leads to the scrapping of semiconductor wafers. Due to the high environmental requirements for semiconductor wafer cutting, dust needs to be ...

AI Technical Summary

Problems solved by technology

[0003] At present, in the cutting technology on the market, laser cutting is mostly used. Although the cutting effect is good and the process is good, heat is generated, which is easy to cause wafer deformation. At the same time, the heat-affected zone is also easy to cause circuit rust, which in turn leads to the scrapping of semiconductor wafers. Due to the high environmental requirements for semiconductor wafer cutting, dust needs to be avoided. In addition, the cutting head is a vulnerable part. If it is not properly set, it will often lead to difficulty in replacing the cutting head and reduce production. At the same time, if the semiconductor wafer cutting process, Without stable fixation, semiconductor wafers will often be completely scrapped. Therefore, in view of the above status quo, it is urgent to develop a semiconductor wafer precision cutting device to overcome the shortcomings in current practical applications.

Images