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Method for etching organic film and method for repairing display area circuit of display substrate

A technology for display substrates and organic films, applied in circuits, electrical components, electrical solid devices, etc., can solve problems such as speeding up the etching speed, and achieve the effect of speeding up the etching speed, ensuring the etching effect, and good etching effect.

Active Publication Date: 2019-03-29
BOE TECH GRP CO LTD +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In the etching method of the organic film, water vapor is fed to the surface to be etched during the process of etching the organic film by the focused ion beam, so that the position to be etched of the organic film can be etched quickly in a targeted manner, and the During the etching process, it will not cause etching damage to other non-etching positions of the organic film, thereby solving the problem that the non-etching position is damaged by the etching caused by the existing concentrated sulfuric acid etching, and also speeding up the etching process speed

Method used

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  • Method for etching organic film and method for repairing display area circuit of display substrate
  • Method for etching organic film and method for repairing display area circuit of display substrate
  • Method for etching organic film and method for repairing display area circuit of display substrate

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Embodiment 1

[0037] This embodiment provides an etching method for an organic film, which includes etching the position to be etched of the organic film through a focused ion beam, and during the etching process, the to-be-etched surface of the position to be etched of the organic film is into water vapor.

[0038] Wherein, the etching of the organic film is carried out in a real-time vacuum environment.

[0039] The high-energy focused ion beam can make the originally inactive water vapor active, and the active water vapor can react with the organic film to generate volatile substances, which can be pumped out with the real-time vacuum system during the etching process. Outside the etching environment, by injecting water vapor onto the surface to be etched during the process of etching the organic film by the focused ion beam, the position to be etched of the organic film can be etched quickly in a targeted manner, and during the etching process It does not cause etching damage to other ...

Embodiment 2

[0045] This embodiment provides a method for repairing the circuit in the display area of ​​the display substrate. The display substrate includes a substrate and an organic film disposed on the substrate. The substrate is provided with circuit traces corresponding to the display area, and the organic film covers the circuit traces. for protection circuit traces, such as figure 1 and figure 2 As shown, the repairing method includes: Step S10: using the organic film etching method in Embodiment 1 to etch the target position of the organic film, so that the thickness of the target position of the organic film after etching is a preset thickness. Step S11: repairing the wiring of the circuit to be repaired in the substrate. The location of the circuit trace to be repaired corresponds to the location of the target location.

[0046] Wherein, the display substrate includes an organic electroluminescent display substrate. Repairing the circuit traces to be repaired in the substrate...

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Abstract

The invention provides a method for etching an organic film and a method for repairing a display area circuit of a display substrate. The etching method of the organic film comprises the following steps: etching a to-be-etched position of the organic film through a focused ion beam, and introducing water vapor into a to-be-etched surface of the to-be-etched position of the organic film in the etching process. According to the organic film etching method, the water vapor is introduced to the to-be-etched surface in the process of etching the organic film by using the focused ion beam; the to-be-etched position of the organic film can be rapidly etched in a targeted manner, and other non-etched positions of the organic film cannot be etched and damaged in the etching process, so that the problem that the non-etched positions are etched and damaged due to existing concentrated sulfuric acid etching is solved, and meanwhile, the etching speed is also increased.

Description

technical field [0001] The invention relates to the field of display technology, in particular to an etching method of an organic film and a repair method of a circuit in a display area of ​​a display substrate. Background technique [0002] Due to the advantages of high contrast, wide color gamut, fast response speed, and bendability, flexible OLED display panels are increasingly used in smart display terminals and become the next-generation display technology. [0003] The flexible OLED display panel is made up of multi-layer thin films. Since the TFT pixel drive circuit is located at the bottom of the substrate, it is impossible to directly test the electrical characteristics of the TFT in the display area. It is necessary to test the electrical characteristics of the TFT fabricated in the edge area of ​​the panel, and then The electrical properties of the TFTs in the display area are inferred from the electrical properties of the TFTs in the panel edge area. However, du...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L51/56
CPCH10K59/1201H10K71/00
Inventor 包征范磊辛燕霞
Owner BOE TECH GRP CO LTD
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