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Automatic furnace body feeding and discharging mechanism for silicon wafer production

A technology of automatic loading and unloading, transmission mechanism, applied in furnaces, crystal growth, furnace components, etc., to achieve the effect of high stability, high safety level, and reduced work intensity

Pending Publication Date: 2019-04-02
TIANJIN HUANXIN TECH DEV
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] The purpose of the present invention is to solve the problems caused by the manual boat insertion operation in the background technology, and provide an automatic loading and unloading mechanism for the furnace body used for silicon wafer production. Loading and unloading action of furnace equipment such as annealing furnace and firing furnace

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  • Automatic furnace body feeding and discharging mechanism for silicon wafer production
  • Automatic furnace body feeding and discharging mechanism for silicon wafer production
  • Automatic furnace body feeding and discharging mechanism for silicon wafer production

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Embodiment Construction

[0033] Such as figure 1 and figure 2 As shown, this example includes a furnace body 7, the furnace body 7 is connected to the equipment frame 1, a feeding mechanism and a blanking mechanism are arranged in turn on the equipment frame 1, and the feeding mechanism and the horizontal plane are provided with an inclination angle less than 10°. A manipulator 5 is set to grab and transfer silicon wafers. The feeding mechanism, unloading mechanism and manipulator are all controlled by the control system. Take out the fixed pitch and put it into the holding device 6. In this example, the holding device 6 adopts a quartz boat, which is transferred to the furnace body through the suction piece of the manipulator. The paddle and the screw drive mechanism are also arranged on the equipment frame 1, and the screw The transmission mechanism is arranged on the furnace mouth end close to the furnace body 7, and one end of the paddle is fixedly installed on the screw transmission mechanism, ...

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Abstract

The invention discloses an automatic furnace body feeding and discharging mechanism for silicon wafer production. The automatic furnace body feeding and discharging mechanism comprises a furnace body;the furnace body is connected to an equipment framework, the equipment framework is sequentially provided with a feeding mechanism and a discharging mechanism, and an inclination angle less than 10 degrees is formed between the feeding mechanism and a horizontal plane; and a mechanical arm is arranged on the equipment framework, the mechanical arm is used for grabbing and transferring a silicon wafer, and the feeding mechanism, the discharging mechanism and the mechanical arm are controlled by a control system. The automatic feeding and discharging mechanism has the beneficial effects that the mechanical automation equipment is adopted for replacing existing workers for wafer taking operation, the manual operation amount and the operation intensity can be reduced by utilizing the equipment automation, an operator can simultaneously execute the operation of other equipment, the number of operators and the cost of the operators are reduced, the loss of a high wafer breakage rate causedby manual operation errors is eliminated, and the silicon wafer pollution caused by manual operation can be avoided.

Description

technical field [0001] The invention belongs to the technical field of silicon wafer production automation equipment, and in particular relates to an automatic loading and unloading mechanism for a furnace body used for silicon wafer production. Background technique [0002] With the development of the semiconductor industry, the demand for processing capacity of semiconductor silicon wafers is increasing day by day, and an automatic loading and unloading system for furnace equipment for silicon wafer production is needed to replace manual boat insertion and manual chip removal operations. At present, when silicon wafers are processed in annealing furnaces, firing furnaces, etc., operators need to take silicon wafers out of the loading device used in the previous process and place them on a quartz boat at a fixed pitch (usually 4.76mm or 2.38mm). Among them, the so-called manual boat insertion operation. [0003] The manual chip removal operation means that the operator tak...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): F27D3/00C30B33/02
CPCF27D3/00C30B33/02F27D2003/0086F27D2003/0002F27D2003/0046
Inventor 牛慧锋徐长坡陈澄梁效峰杨玉聪甄辉齐风李亚哲黄志焕王晓捧王宏宇王鹏徐艳超
Owner TIANJIN HUANXIN TECH DEV
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