Cleaning method for accelerating recovery of process chamber

A process chamber and cleaning gas technology, which is applied in the manufacture of discharge tubes, electrical components, semiconductor/solid-state devices, etc., can solve the problems of long time consumption, prolonged recovery time of the process chamber, and inability to effectively control the flow of cleaning gas, etc. The effect of achieving stable mass production conditions, speeding up the resumption process, and shortening the resumption time

Active Publication Date: 2019-04-02
BEIJING NAURA MICROELECTRONICS EQUIP CO LTD
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  • Claims
  • Application Information

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Problems solved by technology

[0005] However, in the above-mentioned recovery process, the process chamber is cleaned after a long period of time (about 2-4 hours) due to the evacuation of the process chamber.
As a result, this results in significantly longer turn-around times for process chambers,

Method used

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  • Cleaning method for accelerating recovery of process chamber
  • Cleaning method for accelerating recovery of process chamber
  • Cleaning method for accelerating recovery of process chamber

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Embodiment Construction

[0071] Specific embodiments of the present invention will be described in detail below in conjunction with the accompanying drawings. It should be understood that the specific embodiments described here are only used to illustrate and explain the present invention, and are not intended to limit the present invention.

[0072] Such as figure 1 , figure 2 , image 3 and Figure 4 As shown, the first aspect of the present invention relates to a cleaning method for accelerating process chamber recovery, and the cleaning method includes:

[0073] Executing the preparation process S110 before cleaning the process chamber, the preparation process S110 includes:

[0074] S111, heating the process chamber, so that the temperature in the process chamber meets the preset temperature for cleaning impurities.

[0075] Specifically, in this step, the temperature in the process chamber can be set in advance, and then the temperature in the process chamber can meet the preset temperatur...

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Abstract

The invention discloses a cleaning method for accelerating the recovery of a process chamber. The method comprises the steps of: heating a process chamber such that the temperature in the process chamber meets a preset temperature for cleaning impurities; after delay of the first predetermined time, initially performing vacuum supply of the process cavity; cyclically performing fast cleaning of the process cavity; cyclically executing the deep cleaning of the process cavity, wherein the flow of cyclically executing the deep cleaning of the process cavity comprises, controlling the first cleaning gas flow flowing into the process cavity to allow the first cleaning gas flow to meet a preset first cleaning gas flow to perform deep cleaning for the process cavity, and/or, controlling the firstcleaning gas flow speed of the flow flowing into the process cavity to allow the first cleaning gas flow speed to meet the preset first cleaning gas flow speed to perform deep cleaning of the processcavity; and initializing the process cavity to complete cleaning for the process cavity. The recovery time of the process cavity can be effectively shortened and the cleaning efficiency of the process cavity can be improved.

Description

technical field [0001] The invention relates to the technical field of semiconductor manufacturing, in particular to a cleaning method for accelerating the recovery of a process chamber. Background technique [0002] Plasma equipment is widely used in today's semiconductor, solar cell, flat panel display and other manufacturing processes. With the improvement of factory automation level, higher and higher requirements are put forward for the automation degree and rapid recovery ability of production line equipment. After the process chamber is shut down for maintenance, a series of operations to restore the process chamber are required. If the process chamber can quickly meet the process conditions, the recovery time can be greatly shortened, the production capacity can be increased, the product quality can be improved, and the maintenance cost can be reduced. [0003] In the etching machine process equipment, especially for the IC (integrated circuit) manufacturing process...

Claims

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Application Information

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IPC IPC(8): H01J37/32H01L21/67
CPCH01J37/32853H01J37/32862H01L21/67023
Inventor 李晓鹏
Owner BEIJING NAURA MICROELECTRONICS EQUIP CO LTD
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