Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Method for relieving low-temperature stress injury of chili seedlings

A technology of low temperature stress and pepper, applied in horticultural methods, botanical equipment and methods, seed immunity, etc., can solve problems affecting market supply, quality reduction, fresh weight and dry weight reduction, etc., to alleviate stress damage, improve resistance Cooling capacity, the effect of simple and easy method

Inactive Publication Date: 2019-04-09
HONGHE COLLEGE
View PDF3 Cites 5 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] At present, low temperature stress has become the most common and most influential limiting factor for pepper production. After pepper plants are subjected to low temperature stress, their growth will be significantly inhibited, and the fresh weight and dry weight of the aerial parts of the plant will decrease rapidly, which seriously affects the production of pepper. Normal growth and development lead to a sharp drop in yield and quality, which will bring greater economic losses to farmers and affect market supply

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Method for relieving low-temperature stress injury of chili seedlings
  • Method for relieving low-temperature stress injury of chili seedlings
  • Method for relieving low-temperature stress injury of chili seedlings

Examples

Experimental program
Comparison scheme
Effect test

experiment example

[0038] Experimental example, spraying 24-epibrassinolide to the method for pepper seedling growth under low temperature stress, carry out according to the following steps:

[0039] 1. Material preparation: preparation of capsicum seeds, matrix, and 24-epibrassinolide.

[0040] 2. Seed selection and disinfection: select chili seeds with uniform size, full grain, and uniformity, and use 0.4% KMnO for the chili seeds first 4 Disinfect for 6 minutes, then rinse with distilled water 3-5 times to complete the disinfection of pepper seeds;

[0041] 3. Seed soaking and germination: soak the pepper seeds obtained in step (2) in distilled water for 12 hours, then place them neatly on the gauze laid in the germination tray, cover the gauze, put the germination tray into the artificial intelligence climate box, set The temperature was 30°C, the humidity was 95%, and the germination was accelerated in the dark for 5 days, during which distilled water was added to keep it moist.

[0042] ...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
Diameteraaaaaaaaaa
Heightaaaaaaaaaa
Login to View More

Abstract

The invention discloses a method for relieving low-temperature stress injury of chili seedlings. The method comprises steps as follows: selecting chili seeds with uniform size and full and consistentgrains; uniformly mixing vermiculite and perlite in the volume ratio being 3:1 to serve as a matrix; preparing EBR (24-epibrassinolide); performing disinfection, seed soaking and germination acceleration treatment on the chili seeds; sowing the chili seeds after germination acceleration treatment in the matrix, and watering the chili seeds with 1 / 2 Hoagland nutrient solution; after seedlings comeinto 6-7 true leaves, spraying an EBR spray solution with the concentration being 0.1 mu M to leaves of seedlings at the low-temperature stress temperature at 20:00 clock every day and spraying the EBR spray solution continuously for 3 d, wherein the low-temperature stress temperature is the temperature which is lower than 20 DEG C in the daytime and is 5-12 DEG C at night. By means of the method,the cold resistance of the chili seedlings can be improved, stress injury of low-temperature cold damage to the chili seedlings can be relieved, and the scheme is convenient and easy to implement andnot limited by territory.

Description

technical field [0001] The application belongs to the technical field of vegetable seedling cultivation, and in particular relates to a method for alleviating the damage caused by low temperature stress to pepper seedlings. Background technique [0002] In recent years, my country's facility vegetable production has developed rapidly. Solar greenhouses and greenhouses are currently the main types of facilities in my country, mainly used for vegetable production in cold seasons. However, due to the weak environmental regulation ability of horticultural facilities such as solar greenhouses and greenhouses, vegetable production often suffers from low temperature (suboptimal temperature, lower than 20°C during the day / between 5-12°C or lower at night), weak light (less than 100μmol m -2 ·s -1 ) Adversity hazards. [0003] At present, low temperature stress has become the most common and most influential limiting factor for pepper production. After pepper plants are subjected ...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): A01G22/05A01G7/06A01C1/00A01C1/02A01C1/08
CPCA01C1/00A01C1/02A01C1/08A01G7/06A01G22/05
Inventor 李杰杨萍王田涛杨若鹏苏一兰
Owner HONGHE COLLEGE
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products