oled substrate, display device
A substrate and substrate technology, applied in semiconductor devices, electrical components, circuits, etc., can solve the problems of glass powder and substrate cracking, high stress, poor elasticity, etc.
Active Publication Date: 2021-04-30
BOE TECH GRP CO LTD
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Problems solved by technology
However, due to the uneven contact surface of the glass powder after drying, the small diameter of the through hole makes the contact surface between the glass powder and the substrate small, and the glass powder itself has poor elasticity and high stress after curing, resulting in OLED devices receiving external forces ( Handling, loading and unloading, etc.) are prone to cracking of the glass powder and the substrate, which affects the packaging effect
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[0031] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some of the embodiments of the present invention, not all of them. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.
[0032] Unless otherwise defined, the technical terms or scientific terms used herein shall have the usual meanings understood by those skilled in the art. "First", "second" and similar words used in the patent application specification and claims of the present invention do not indicate any order, quantity or importance, but are only used to distinguish different components. "Comprising" or "comprising" and similar words indicate that the element...
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Abstract
The invention provides an OLED substrate and a display device, which relate to the field of display technology and are used to improve the problem that the encapsulation effect of an OLED device is affected by cracks between glass powder and a substrate. The OLED substrate is divided into a glass glue coating area, and the OLED substrate includes a substrate and a lead provided on the substrate, and a first via hole is provided on the lead, and the first via hole is located on the substrate. The glass glue coating area; also includes a coupling agent layer arranged on the side of the lead close to the substrate, the coupling agent layer is located in the glass glue coating area, and the first via hole exposes the The coupling agent layer; the material of the coupling agent layer has an instantaneous withstand temperature of 1000-1600°C and a long-term withstand temperature of 450-600°C.
Description
technical field [0001] The invention relates to the field of display technology, in particular to an OLED substrate and a display device. Background technique [0002] OLED (Organic Light-Emitting Diode, organic electroluminescent diode) display device has thin, light, wide viewing angle, active light emission, continuously adjustable light color, low cost, high color gamut, high contrast, fast response speed, and low energy consumption. The advantages of small size, low driving voltage, wide operating temperature range, simple production process, high luminous efficiency and flexible display have been listed as the next generation display technology with development prospects. [0003] However, the organic materials and metal electrodes inside the OLED device are prone to react with water and oxygen, resulting in device failure. Therefore, the device needs to be packaged to prolong its service life. Glass glue (frit) packaging adopts the method of melting glass powder to b...
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IPC IPC(8): H01L27/32
CPCH10K59/88H10K59/00
Inventor 罗程远
Owner BOE TECH GRP CO LTD