Three-dimensional tin paste coating method for inner conductor of coaxial electric connector and printed board bonding pad
An electrical connector, three-dimensional technology, applied in the manufacture of printed circuits, assembly of printed circuits with electrical components, coating, etc., can solve the problems of insufficient consistency control, coating amount control, interconnection welding, etc., to achieve multiple guarantees Point continuity, the effect of improving uniformity
Active Publication Date: 2019-04-09
BEIJING RES INST OF TELEMETRY +1
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Problems solved by technology
[0003] The technical problem of the present invention is: to overcome the problem of insufficient solder paste coating amount control, point control, and consistency control at the current three-dimensional pad position of the coaxial electrical connector, and to provide a coaxial electrical connector inner conductor and printed circuit board. The three-dimensional solder paste coating method of the board pad solves the problems of solder paste coating and interconnection welding of the three-dimensional pad
Method used
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Embodiment 1
[0049] For a certain type of connector, the length of the inner conductor is 1.0mm, the diameter is 0.3mm, and the width of the printed board pad is 0.76mm. The X-axis coordinates and Y-axis coordinates of a single point are respectively equal to the X-axis coordinates and Y-axis coordinates of the center point of the end face of the weldable section, and the Z-axis coordinates deviate from the center point of the end face of the weldable section of the inner conductor along the positive direction of the Z axis by 0.15mm . After the solder paste is coated, control the apex of the needle of the solder paste syringe to move 0.1mm in the negative direction of the X-axis and 0.1mm in the positive direction of the X-axis with the coating end point as the center, move 0.1mm in the negative direction of the Y-axis, and move in the positive direction of the Y-axis Move 0.1mm, move 0.1mm in the negative direction of the Z axis, and move 0.1mm in the positive direction of the Z axis, an...
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Abstract
The invention discloses a three-dimensional tin paste coating method for an inner conductor of a coaxial electric connector and a printed board bonding pad. The method comprises the following steps ofS1, fixing the inner conductor of the coaxial electric connector and a printed board body structure in order to enable an axis of the inner conductor to be parallel to a center line of the printed board bonding pad, enable a plane formed by the axis of the inner conductor and the center line of the printed board bonding pad to be perpendicular to a plane where the printed board bonding pad is located, and enable a projection of a tail section or a middle section of the inner conductor on the plane where the printed board bonding pad is located to coincide with the bonding pad; S2, defining the axis of the inner conductor as an X direction, the plane where the printed board bonding pad is located as an XOY plane, and the plane formed by the axis of the inner conductor and the center line of the printed board bonding pad as an XOZ plane, and constructing a rectangular coordinate system; S3, controlling the vertex of a tin paste needle cylinder to continuously and uniformly coat tin paste along a preset spatial graphic trace according to the difference between the diameter of the inner conductor and the welding length; and S4, after coating is completed, controlling the vertex of thetin paste needle cylinder to carry out scraping at a coating end point. The method is efficient and reliable.
Description
technical field [0001] The invention relates to a three-dimensional solder paste coating method for the inner conductor of the coaxial electrical connector and the solder pad of the printed circuit board, and is especially suitable for the solder paste for the three-dimensional welding of the inner conductor of the coaxial electrical connector of the electronic product and the solder pad of the printed circuit board The coating method belongs to the technical field of electronic product welding. Background technique [0002] In the field of electronic products, the three-dimensional interconnection and welding of the inner conductor of the coaxial electrical connector and the printed board is used to realize the input / output of electrical signals. The welding process has the following characteristics: there is a stepped height difference between the inner conductor of the connector and the printed board, the shape difference between the inner conductor and the printed board ...
Claims
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Patent Timeline
Login to View More IPC IPC(8): H05K3/34B05D1/26
CPCB05D1/26H05K3/341
Inventor 周红康楠陈巍宋涛刘晓剑王杰景翠刘德喜史磊
Owner BEIJING RES INST OF TELEMETRY
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