Optical module and welding method thereof

Abstract

The invention discloses an optical module and a welding method thereof. The optical module comprises a PCB, an optoelectronic component and a flexible circuit board which is connected with the PCB andthe optoelectronic component; wherein the optoelectronic component comprises a light emitting assembly, the light emitting assembly comprises a matching surface which is connected with the flexible circuit board in a matched mode, and an electric connecting part is arranged on the matching surface; the flexible circuit board comprises a bonding pad region which is adapted to the matching surface,the bonding pad region is provided with a grounding bonding pad used for being connected with the electrical connection portion, and a conductive region electrically connected with the grounding bonding pad, the conductive region is arranged on the side, opposite to the matching surface, of the flexible circuit board and is electrically fixed on the matching surface. According to the method, theconductive region is arranged on the flexible circuit board which is connected with the light emitting assembly in the optoelectronic component, so that comprehensive welding can be achieved between the flexible circuit board and the matching surface of the emitting light assembly, so that the backflow path of the high-speed signal is improved, the impedance continuity of the high-speed line is optimized, and the performance of the transmitting end eye diagram of the optical module is improved.

Description

technical field [0001] The invention relates to the technical field of optical modules, in particular to an optical module and a welding method thereof. Background technique [0002] The demand of the communication market has been promoting the improvement of the basic transmission rate of optical communication, and the improvement of the basic transmission rate of the photoelectric conversion module depends to a large extent on the performance of the optical device itself and the driving ability of the driving chip; among them, with the signal With the improvement of the transmission rate, the integrity of the electrical signal has been raised to a new level. As the single-channel signal transmission rate is increased to 25G, the optical module design has increasingly stringent requirements for PCB (Printed Circuit Board, printed circuit board) wiring. For If the impedance matching of the high-speed signal line design is not perfect, it will greatly affect the effect of opt...

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Problems solved by technology

[0002] The demand of the communication market has been promoting the improvement of the basic transmission rate of optical communication, and the improvement of the basic transmission rate of the photoelectric conversion module depends to a large extent on the performance of the optical device itself and the driving ability of the driving chip; among them, with the signal With the improvement of the transmission rate, the integrity of the electrical signal has been raised to a new level. As the single-channel signal transmission rate is increased to 25G, the optical m

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