Transfer printing substrate, transfer printing equipment and transfer method of light emitting diode chips
A technology of light-emitting diodes and transfer substrates, which is applied to electrical components, conveyor objects, transportation and packaging, etc., and can solve problems such as the inability to transfer Micro-LED components
Active Publication Date: 2020-08-18
BOE TECH GRP CO LTD
View PDF8 Cites 0 Cited by
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
[0004] Embodiments of the present invention provide a transfer substrate, transfer equipment, and a method for transferring light-emitting diode chips to solve the problem in the prior art that a large number of Micro-LED components cannot be transferred to the drive backplane
Method used
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View moreImage
Smart Image Click on the blue labels to locate them in the text.
Smart ImageViewing Examples
Examples
Experimental program
Comparison scheme
Effect test
Embodiment Construction
[0036] Aiming at the problem that a large number of Micro-LED components cannot be transferred to the driving backplane in the prior art, the embodiment of the present invention provides a transfer method for a transfer substrate, a transfer device, and a light-emitting diode chip.
[0037] The specific implementations of the transfer substrate, the transfer device, and the transfer method of the light-emitting diode chip provided by the embodiments of the present invention will be described in detail below with reference to the accompanying drawings. The thickness and shape of each film layer in the drawings do not reflect the true ratio, and the purpose is only to illustrate the content of the present invention schematically.
[0038] In the first aspect, embodiments of the present invention provide a transfer substrate, such as figure 1 As shown, it includes: a substrate 101, a groove on the surface of one side of the substrate 101, and a micro-flow control circuit (not shown in ...
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More PUM
Login to View More Abstract
The invention discloses a transfer substrate, transfer equipment and a transfer method of a light-emitting diode chip, and the transfer substrate comprises a substrate, a groove located on the surfaceof one side of the substrate, and a micro-flow control circuit located between the substrate and the groove. The groove comprises a channel used for transmitting infusion drops, and an accommodatinggroove which is located at any side of the channel and connected with the channel. A hydrophobic layer is arranged on the surface of the channel, and a hydrophilic layer is arranged on the surface ofthe accommodating groove. The transfer substrate also comprises the micro-flow control circuit which is used for driving the liquid drops carrying the light-emitting diode chip to move to the accommodating groove in the channel and controlling the liquid drops to place the light-emitting diode chip in the accommodating groove. because the micro-flow control circuit can drive the liquid drops to move in the channel so as to carry the light-emitting diode chip to the accommodating groove and control the liquid drops to place the light-emitting diode chip in the accommodating groove, the light-emitting diode chip can be conveniently and subsequently transferred to the corresponding driving back plate, thereby achieving the transferring of a large number of light-emitting diode chips.
Description
Technical field [0001] The invention relates to the field of display technology, in particular to a transfer method of a transfer substrate, a transfer device and a light emitting diode chip. Background technique [0002] With the development of Light Emitting Diode (LED) technology, Micro-LED display technology will become the next generation of revolutionary technology. Micro-LED is the miniaturization and matrixization of traditional LED structures. , And use integrated circuit technology to make a drive circuit to realize the display technology of each pixel address control and individual drive. Because Micro-LED technology’s brightness, life span, contrast ratio, response time and other indicators are stronger than liquid crystal displays (LCD) and organic light-emitting diode displays (OLED), plus it belongs to its own The advantages of light-emitting, simple structure, small size and energy saving have been regarded by many manufacturers as the next-generation display tec...
Claims
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More Application Information
Patent Timeline
Login to View More Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/67H01L21/677
CPCH01L21/67011H01L21/6715H01L21/67739H01L21/67763
Inventor 董水浪王利忠刘清召党宁谷新
Owner BOE TECH GRP CO LTD