Method for producing hollow structure, plated composite and hollow structure

A manufacturing method and structure technology, which is applied in semiconductor/solid-state device manufacturing, rigid tube cable manufacturing, liquid chemical plating, etc., can solve the problems of limitation and increased space occupied by heat sinks, etc.

Active Publication Date: 2019-04-16
ASAHI DENKA KENKYUSHO
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

Therefore, there is a problem that the space occupied by the cooling fan and the cooling fins in the device as a whole is increased, and the types and numbers of devices to be mounted are limited.

Method used

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  • Method for producing hollow structure, plated composite and hollow structure
  • Method for producing hollow structure, plated composite and hollow structure
  • Method for producing hollow structure, plated composite and hollow structure

Examples

Experimental program
Comparison scheme
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Embodiment Construction

[0051] When manufacturing a hollow structure, first, a core material described later is prepared. In this embodiment, a plating layer covering the entire surface of the core material is formed, and then a part of the plating layer is cut off to manufacture a plating composite in a form in which the cut surface of the core material is exposed.

[0052] Next, only the core material is selectively dissolved and removed by immersing the plated composite with a part of the core material exposed in a solution described later. In the hollow structure finally obtained by this immersion treatment, the core material of the plating complex is converted into a hollow part, and the plating layer remains as it is, forming a plated layer consisting of an upper surface part and a lower surface part. A skeleton part of an integral structure consisting of a plating layer and a cylindrical plating layer connecting the two plating layers (in the case of a core material with a through-hole formed ...

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Abstract

The present invention provides: a method for producing a hollow structure that is useful as a base material for heat sinks, etc. that increase heat dissipation of devices installed in various kinds ofelectronic equipment without sacrificing size reduction, thickness reduction, weight reduction and multifunctionality thereof; and a hollow structure. A hollow structure 5 comprising a skeleton 5B that is made of a sum of copper plating layers 3a, 3b and 3c is produced by: covering the surface of an aluminum core 1 to form a copper plating layer 3 and produce a plated composite; cutting portionsof the plated composite to reveal cut surfaces of the core 1; and then immersing said plated composite in an aqueous sodium solution that dissolves aluminum but does not dissolve copper to selectivelydissolve and remove only the aluminum and make certain sites of the core 1 into hollow parts 5A.

Description

technical field [0001] The present invention relates to a method of manufacturing hollow structures useful as heat sinks (radiation fins, heat pipes, vapor chambers) incorporated in various small, thin, and multifunctional semiconductor devices, and to plating composites. bodies and hollow structures. More specifically, it relates to a hollow structure developed by utilizing a joining method of plating a metal used as a temporary plating core material and a metal of a different type from the metal and the difference in solubility of the two metals in a specific solution body manufacturing methods, plated composites, and hollow structures. Background technique [0002] Desktop personal computer (Desktop personal computer), tablet computer (Tablet), smart phone (Smartphone) and other portable information terminals and electronic devices are rapidly developing in miniaturization, thinning, multi-functionality, and light weight. The transmission volume increases, and the infor...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C25D1/02C23C18/38C23F1/00
CPCC23C18/1657C23C18/54C23F1/04C23F1/36C23F1/44C25D1/02C25D1/08H01L21/4871H01L23/367H01L23/3736H01L23/427H01B13/004C23C18/1637C23C18/1641C23C18/1646C23C18/1689C23C18/1834C23C18/38C23F1/00C25D3/38C25D5/44C25D5/48
Inventor 沟口昌范
Owner ASAHI DENKA KENKYUSHO
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