High density pixelated LED and devices and methods thereof

Abstract

At least one array of LEDs (e.g., in a flip chip configuration) is supported by a substrate having a light extraction surface overlaid with at least one lumiphoric material. Light segregation elementsregistered with gaps between LEDs are configured to reduce interaction between emissions of different LEDs and / or lumiphoric material regions to reduce scattering and / or optical crosstalk, thereby preserving pixel-like resolution of the resulting emissions. Light segregation elements may be formed by mechanical sawing or etching to define grooves or recesses in a substrate, and optionally by filling the grooves or recesses with light-reflective or light-absorptive material. Light segregation elements external to a substrate may be defined by photolithographic patterning and etching of a sacrificial material, and / or by 3D printing.

Description

[0001] Cross reference to related applications [0002] This international application claims the benefit of U.S. Patent Application No. 15 / 399,729, filed January 5, 2017, and U.S. Provisional Patent Application No. 62 / 321,514, filed April 12, 2016. The entire contents of the aforementioned applications are hereby incorporated by reference. technical field [0003] The subject matter herein relates to solid state light emitting devices, including addressable light emitting diode (LED) array chips with reduced interaction between emissions from adjacent emitters, devices containing one or more LED array chips, including such devices LED displays and lighting devices and related manufacturing methods. Background technique [0004] LEDs have been widely used in a variety of lighting environments, for backlighting liquid crystal display (LCD) systems (eg, as a replacement for cold cathode fluorescent lamps), and for sequentially illuminating LED displays. Applications that uti...

AI Technical Summary

Problems solved by technology

[0007] Various LED array applications including (but not limited to) high-resolution displays for very short viewing distances and vehicle headlights can benefit from smaller pixel pitches; however, practical considerations limit how this can be achieved

Traditional pick-and-place techniques that can be used to mount LED components and packages to PCBs can be difficult to reliably implement in high-density arrays with small pixel pitches

Additionally, due to the omnidirectional nature of LED and phosphor emissions, it may be difficult to prevent the emission of one LED (e.g., the first pixel) from significantly overlapping that of another LED of the array (e.g., the second pixel), which would damage the LED array Device Effective Resolution

It can also be difficult to avoid unlit or "dark" areas between adjacent LEDs (e.g., pixels) to improve uniformity, especially while reducing crosstalk or light spillage between the emissions of adjacent LEDs

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