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Joint for thermal bubble micropump

A technology of micropump and hot bubble, which is applied in the direction of laboratory containers, laboratory utensils, chemical instruments and methods, etc., and can solve the problem of difficult connection of hot bubble micropump on the surface

Active Publication Date: 2019-04-23
SHANGHAI AUREFLUIDICS TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, due to the softness of the cross-linked polydimethylsiloxane, it is difficult to directly use any adhesive on the surface of the thermal foam micropump connection.

Method used

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  • Joint for thermal bubble micropump
  • Joint for thermal bubble micropump
  • Joint for thermal bubble micropump

Examples

Experimental program
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Effect test

Embodiment 1

[0030] Embodiment 1 of the present application provides a joint for a heat bubble micropump, Figure 5 is an exploded schematic diagram of the components of the joint, such as Figure 5 As shown, the joint 5 may include: a gasket 2 , a top cover 3 and a connecting pipe 4 . Such as Figure 5 As shown, the thermal bubble micropump 1 can be arranged in the connection 5 .

[0031] figure 1 is a schematic diagram of the thermal bubble micropump, figure 2 is a schematic diagram of the gasket of this embodiment, image 3 is a schematic diagram of the top cover of this embodiment, Figure 4 is a schematic diagram of the connecting pipe of this embodiment.

[0032] Such as figure 1 As shown, the thermal bubble micropump 1 can have a channel opening 11 through which liquid can flow into or out of the thermal bubble micropump 1 . The distance between the centers of the two flow channel openings 11 can have different specifications, such as 1.5mm, 2.5mm, 3.5mm, 4.5mm and so on. ...

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PUM

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Abstract

The present invention provides a joint for a thermal bubble micropump. The joint comprises: a gasket, wherein the gasket has a first surface for placing a thermal bubble micropump, and through holes,and the through hole has a first opening at the first surface, and a second opening at a second surface, different from the first surface, of the gasket; a top cover, wherein the top cover is combinedwith the gasket, and covers the first surface; and connecting pipes, wherein the connecting pipes are inserted into the through holes from the second openings. According to the present invention, thefast, firm, standardized and repeatable plug-type connection between the thermal bubble micropump and the polydimethylsiloxane microfluidic chip can be achieved, such that the applications of the semiconductor thermal bubble micropump in the dimethylsiloxane microfluidic chips can be easily achieved.

Description

technical field [0001] The present application relates to the fields of semiconductor integrated circuits and microfluidics, in particular to a joint for thermal bubble micropumps. Background technique [0002] Microfluidic technology is widely used in medical real-time detection and research in biology and pharmacy in colleges and universities. [0003] In microfluidic technology, microfluidic chips are control containers for chemical and biological reactions. The flow of liquid in a microfluidic chip requires an external power device or module. Thermal bubble micropumps are currently the most miniaturized power components that are easy to integrate with microfluidic chips. Although there are many options for fabricating microfluidic chips, polydimethylsiloxane is the first choice for prototype chip fabrication. However, due to its softness, it is difficult to directly use any adhesive on the surface of the crosslinked polydimethylsiloxane for hot-bubble micropump connec...

Claims

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Application Information

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IPC IPC(8): B01L3/00
CPCB01L3/502707B01L3/50273
Inventor 吴炫烨关一民
Owner SHANGHAI AUREFLUIDICS TECH CO LTD
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