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Heat-insulated micropump driven by induction heating thermal bubbles and preparation method thereof

A technology of induction heating and hot bubbles, applied in induction heating, induction heating devices, pumps, etc., can solve the problems of damage to the biological or chemical properties of the solution, high temperature, and achieve the effect of reducing damage and improving application prospects.

Active Publication Date: 2022-06-07
BEIJING UNIV OF TECH
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The temperature of the hot air bubbles is high, and the use of hot air bubbles to directly drive the liquid will cause the temperature of part of the pumped solution to be too high, thereby damaging some of the biological or chemical properties of the solution

Method used

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  • Heat-insulated micropump driven by induction heating thermal bubbles and preparation method thereof
  • Heat-insulated micropump driven by induction heating thermal bubbles and preparation method thereof
  • Heat-insulated micropump driven by induction heating thermal bubbles and preparation method thereof

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Embodiment Construction

[0032] The fabrication of the thermal bubble-driven micropump consists of two parts: firstly, the fabrication of the micro-heating plate 6 , and secondly, the fabrication of the PDMS chip 4 .

[0033] In the present invention, the micro-heating plate 6 is manufactured by electroplating technology, and the specific technological process is as follows:

[0034] first step, Figure 7 As shown in (a), the substrate 5 is cleaned with deionized water, and dried on a glue drying table with a temperature of 120°C;

[0035] The second step, Figure 7 As shown in (b), first sputter chromium 37 and copper 38 on the substrate 6, and then spin-coat positive photoresist 39;

[0036] third step, Figure 7 As shown in (c), the micro-hot plate mask 43 is used for exposure, and then developed and hardened;

[0037] the fourth step, Figure 7 As shown in (d), an electroplating process is used to electroplate the metal heating plate 6;

[0038] the fifth step, Figure 7 As shown in (e), the ...

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Abstract

Heat-insulated micropump driven by induction heating and preparation method Thermal bubble drive for microfluid delivery, specifically a heat-bubble-driven micropump with heat source isolation function, using high-frequency alternating current wireless induction heating to generate heat bubbles , to drive the micropump. The liquid is used to isolate the heat source from the pumped liquid in the microchannel, reducing the influence of high temperature on the properties of the solution. This heat-insulated hot-bubble-driven micropump not only has the advantages of simple and easy-to-integrate structure, low working voltage, and long service life of ordinary hot-bubble micropumps, but also can reduce the temperature of the pumped liquid and reduce the impact of high temperature on some organisms in the solution. Or the damage of chemical substances, so the heat-bubble-driven heat-insulated micropump has a better application prospect.

Description

technical field [0001] The invention is a thermal bubble-driven micro-pump for micro-fluid transportation, specifically a thermal-bubble-driven micro-pump with a heat source isolation function, which utilizes high-frequency alternating current wireless induction heating to generate thermal bubbles, and realizes the drive of the micro-pump. . The liquid is used to isolate the heat source from the liquid being pumped in the microfluidic channel to reduce the effect of high temperature on the solution properties. This heat-insulating hot-bubble-driven micropump not only has the advantages of simple structure and easy integration, low operating voltage and long service life of ordinary hot-bubble micropumps, but also can reduce the temperature of the pumped liquid and reduce the impact of high temperature on some organisms in the solution. or chemical damage, so the thermal bubble-driven thermal insulation micropump has better application prospects. Background technique [000...

Claims

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Application Information

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IPC IPC(8): F04B19/00H05B6/02H05B6/10H05B6/36
CPCF04B19/006H05B6/02H05B6/10H05B6/36
Inventor 刘本东马晨旭张乃龙杨佳慧
Owner BEIJING UNIV OF TECH
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