A thermal bubble-driven micropump for fixed-point growth of bubbles and its preparation method

A technology of hot air bubbles and micropumps, applied in lighting and heating equipment, machine operation methods, pumps, etc., can solve problems such as low stability and reliability, blockage of microchannels, low pumping frequency, etc., and achieve improved Reliability and stability, the effect of accelerating cooling shrinkage

Active Publication Date: 2022-04-12
BEIJING UNIV OF TECH
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The purpose of the present invention is to overcome the disadvantages of air bubbles clogging microchannels, low pumping frequency, low stability and reliability, etc., and propose an induction heating hot air bubble driven micropump with fixed-point growth of air bubbles and a cooling device

Method used

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  • A thermal bubble-driven micropump for fixed-point growth of bubbles and its preparation method
  • A thermal bubble-driven micropump for fixed-point growth of bubbles and its preparation method
  • A thermal bubble-driven micropump for fixed-point growth of bubbles and its preparation method

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Embodiment Construction

[0033] The manufacture of the thermal bubble-driven micropump consists of two parts: first, the manufacture of the heating plate 7 , and second, the manufacture of the PDMS chip 5 .

[0034] In the present invention, the heating plate 7 is manufactured by an electroplating process, and the specific process flow is as follows:

[0035] first step, Figure 8 As shown in (a), use deionized water to clean the glass substrate 6, and dry it on a glue drying table with a temperature of 110°C;

[0036] second step, Figure 8 Shown in (b), earlier sputter metal chromium 45 and metal copper 46 on glass substrate 6, then spin-coat positive photoresist 47;

[0037] third step, Figure 8 Shown in (c), adopt the heating plate mask plate 52 to expose, then develop and harden the film;

[0038] the fourth step, Figure 8 As shown in (d), an electroplating process is used to electroplate the metal heating plate 7;

[0039] the fifth step, Figure 8 As shown in (e), the positive photores...

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Abstract

A thermal bubble-driven micropump and a preparation method for fixed-point growth of bubbles belong to the field of microfluidic technology. The present invention is a heat-bubble-driven micro-pump used for micro-fluid delivery, specifically a heat-bubble-driven micropump using high-frequency current wireless induction heating manufactured by MEMS micromachining technology. Heating plate, the micro-heating plate is designed with recesses arranged in a certain regular shape, so that the recesses can adjust the growth position of the hot bubbles, by controlling the periodic expansion and contraction of the hot bubbles, combined with the different resistances of the micro-channels on both sides of the pump chamber , and finally the micropump achieves directional pumping. In order to improve the reliability and operating frequency of the micropump, a cooling device is added to the micropump to enhance the heat dissipation capability of the micropump in the shrinking stage of the thermal bubble. The micropump proposed by the invention can be widely used in the fields of aerospace, biomedicine, chemistry and the like.

Description

technical field [0001] The present invention is a heat-bubble-driven micro-pump used for micro-fluid delivery, specifically a heat-bubble-driven micro-pump using high-frequency current wireless induction heating manufactured by MEMS micro-machining technology. The heating plate and the micro-heating plate are designed with recesses arranged in a certain regular shape, so that the recesses can adjust the growth position of the hot bubbles. By controlling the periodic expansion and contraction of the hot bubbles, combined with the different resistances of the micro-channels on both sides of the pump chamber , and finally the micropump achieves directional pumping. In order to improve the reliability and operating frequency of the micropump, a cooling device is added to the micropump to enhance the heat dissipation capability of the micropump in the shrinking stage of the thermal bubble. The micropump proposed by the invention can be widely used in the fields of aerospace, biome...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): F04B19/00H05B6/10H05B6/36H05B6/02F25B21/02F24H9/18F24H9/20
CPCF04B19/006H05B6/02H05B6/10H05B6/36F25B21/02F24H9/1818F24H9/2014F25B2321/02F24H2250/08
Inventor 刘本东王龙马晨旭杨佳慧张乃龙
Owner BEIJING UNIV OF TECH
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