Novel semiconductor refrigeration heat dissipation module

Abstract

The invention discloses a novel semiconductor refrigeration heat dissipation module. A semiconductor refrigeration sheet, a cold plate arranged at the cold end of the semiconductor refrigeration sheet, and a radiator arranged at the heat end of the semiconductor refrigeration sheet are included. The radiator is a heat pipe radiator, and cooling fans are arranged on the front end face of the radiator. The radiator comprises a base and a fin set arranged on the base. The heat pipe radiator is adopted in the novel semiconductor refrigeration heat dissipation module, the flow guiding design of heat dissipation airflow is matched, the wind resistance of heat dissipation airflow is greatly reduced, heat transmitted to the base from the semiconductor refrigeration sheet is better transmitted to the upper portions of fins through heat pipes, the temperature of the front part and the rear part of the base and the upper sides and the lower sides of the cooling fins is balanced, uniformity of thetemperature of the whole radiator is guaranteed, the heat of the lower side, with the highest temperature, of the rear section of the radiator cannot be stacked and is better dissipated, the heat dissipation effect is good, the refrigeration efficiency is high, and the space utilization rate is high.

Description

technical field [0001] The invention relates to the field of semiconductor refrigeration, in particular to a novel semiconductor refrigeration module with high space utilization and good heat dissipation effect. Background technique [0002] The cooling capacity and cooling efficiency of semiconductor refrigerators mainly depend on the temperature and temperature difference between the hot and cold surfaces. Due to the Peltier effect, the semiconductor element will cool at one end and heat at the other end. Therefore, if it is used for cooling, the heat at the other end must be quickly Once the semiconductor refrigerator is cooling, the thermal resistance of the hot surface is too high, which will lead to a decrease in its cooling efficiency. At present, many products have high power and high heat density, and their heat dissipation space is limited, resulting in poor heat dissipation. Therefore, how to dissipate high-density heat in a limited space is an extremely critical ...

AI Technical Summary

Problems solved by technology

[0003] The invention mainly solves the technical problem that the cooling efficiency decreases due to the poor heat dissipation of the existing semiconductor refrigerator; it provides a new type of semiconductor refrigeration and heat dissipation module with high space utilization rate and good heat dissipation effect

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