Substrate loading system and loading method thereof

Abstract

The present invention provides a substrate loading system and a loading method thereof. The system comprises a loading device and at least one substrate storage cassette accommodated in the loading device; the loading device comprises at least one box body and a lifting mechanism matched with the box body, the lifting mechanism comprises a drive module and a lifting module; each substrate storagecassette comprises a storage box and a substrate putting module which is matched with the lifting mechanism, and the lifting mechanism drives the substrate putting module to put into the storage box or to be drawn out from the storage box through the lifting module. The substrate cleaning is separated from an evaporation production line, and a clean substrate is stored in a dry nitrogen environment to prevent the surface of the substrate from pollution. The scheme only needs two separated box bodies on the production line and a plurality of small-type substrate storage cavities; and the two separated substrate loading box bodies perform exchange work to achieve the requirements of OLED device flow sheets.

Description

technical field [0001] The invention belongs to the technical field of substrate vapor deposition, and in particular relates to a substrate loading system and a substrate loading method thereof. Background technique [0002] Organic thin-film electroluminescent display devices (OLED), as a field with broad application prospects, have developed rapidly in recent years, and there is a very large market demand every year. Today, the production of OLED panels is mainly in the form of assembly lines, and the production line can increase output to meet supply demand. ; [0003] The process flow of the OLED panel is to evaporate multiple layers of organic materials on a clean ITO substrate, and finally to coat a layer of metal electrodes. Before evaporating organic materials, it is necessary to ensure the cleanliness of the ITO substrate. Generally, the clean ITO substrate is placed in a vacuum or dry nitrogen environment to protect the ITO surface from contamination; today's larg...

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Problems solved by technology

Before evaporating organic materials, it is necessary to ensure the cleanliness of the ITO substrate. Generally, the clean ITO substrate is placed in a vacuum or dry nitrogen environment to protect the ITO surface from contamination; today's large-scale evaporation equipment cleans and bakes the substrate. Dry integration into the entire OLED production line has resulted in the size of the entire production line being too large. The cleaned ITO substrate will be placed in a vacuum chamber with a transmission device inside. Multiple vacuum chambers are arranged side by side to form a vacuum from Low to high vacuum gradient environment; after the substrate enters a cavity, the front valve is closed, the high pumping speed pump is turned on, the vacuum degree is increased, and the lower valve is opened to enter the next cavity

However, this scheme requires multiple cavities, and the size of each cavity is relatively large, and the selected pumping speed is relatively high, and the vacuum degree is required to be from 1bar to 1.0*10 -5 The transition of Pa leads to the high cost of OLED equipment in this scheme

[0004] For small-scale experimental evaporation equipment, there is generally an ITO substrate loading chamber, and each time it is opened, the ITO substrate is placed, and then vacuumed, which will easily cause the surface of the ITO substrate to be exposed to the air and cause serious pollution, which will affect the OLED panel. has a big impact on the performance of

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