Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Array substrate, display pane and manufacturing method thereof, and display device

A technology for array substrates and display panels, which is applied in semiconductor/solid-state device manufacturing, instruments, organic semiconductor devices, etc., and can solve problems such as overfilling, air bubbles, and excessive packaging layers

Active Publication Date: 2019-04-23
BOE TECH GRP CO LTD
View PDF4 Cites 7 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] In the related art, in the top-emitting OLED device, during the encapsulation process, the fluidity of the filling encapsulation layer is weak, and it is often difficult to fill or overfill
As a result, part of the device is not filled by the encapsulation layer, resulting in bubbles; or excessive encapsulation layer in some areas, and the auxiliary cathode fails; even two problems appear in the same product

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Array substrate, display pane and manufacturing method thereof, and display device
  • Array substrate, display pane and manufacturing method thereof, and display device
  • Array substrate, display pane and manufacturing method thereof, and display device

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0040] Embodiments of the present invention are described in detail below, examples of which are shown in the drawings, wherein the same or similar reference numerals designate the same or similar elements or elements having the same or similar functions throughout. The embodiments described below by referring to the figures are exemplary only for explaining the present invention and should not be construed as limiting the present invention.

[0041] In the description of the present invention, it should be understood that the orientation or positional relationship indicated by the terms "length", "width", "thickness", "upper", "lower", "inner" etc. is based on the Orientation or positional relationship is only for the convenience of describing the present invention and simplifying the description, and does not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and thus should not be con...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
Thicknessaaaaaaaaaa
Login to View More

Abstract

The invention discloses an array substrate, a display panel and a manufacturing method thereof and a display device. The array substrate comprises a substrate and a pixel defining layer. The surface array of the substrate has a plurality of pixel grids, the pixel defining layer is disposed on the substrate, the pixel defining layer defines a plurality of pixel grids arranged in an array, the pixeldefining layer further comprises a plurality of thickness thinning regions, and the thickness thinning regions are suitable for guiding flow of the package layer. According to the array substrate provided by the embodiment of the invention, the pixel defining layer is laid on the substrate, is configured to define a plurality of pixel grids and comprises the plurality of thickness thinning regions, when the substrate is filled with the package layer, the thickness thinning regions can guide the flow direction of the package layer so as to allow the filling of the package layer to be uniform and avoid the condition of the excessive filling or non-full filling of the package layer to cause the conditions of failure or poor performances of the performances of the OLED.

Description

technical field [0001] The present invention relates to the technical field of electronic equipment, in particular, to an array substrate, a display panel, a manufacturing method thereof, and a display device. Background technique [0002] The OLED (Organic Light-Emitting Diode, organic electroluminescent diode) display device includes an anode, an organic layer (including a hole transport layer and an electron transport layer, and an organic light-emitting layer between the hole transport layer and the electron transport layer) and cathode. Compared with LCD display devices, OLED display devices are thin, light, wide viewing angle, active light emission, continuously adjustable light color, low cost, fast response speed, low energy consumption, low driving voltage, wide operating temperature range, and simple production process , high luminous efficiency and flexible display. Due to the incomparable advantages of other displays and bright application prospects, OLED has a...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): H01L27/32H01L51/52H01L51/56
CPCH10K59/122H10K59/121H10K59/8722H10K59/80522H10K59/8723H10K59/173H10K2102/351H10K59/873G02F1/133512G02F1/13394G02F1/133514G02F1/136209H01L27/156H10K50/844H10K50/8428H10K30/82H10K50/14H10K50/15H10K50/16H10K50/824H10K50/8426H10K59/12H10K59/18
Inventor 孙宏达宋泳锡宋振王国英
Owner BOE TECH GRP CO LTD
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products