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A display device and packaging method thereof

A technology for display devices and packaging structures, applied in semiconductor devices, electrical solid devices, electrical components, etc., can solve problems such as poor bonding force, poor radiation resistance of coupling agents, and easy peeling of organic layers and inorganic layers. The effect of packaging reliability and good packaging effect

Active Publication Date: 2020-11-13
YUNGU GUAN TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, due to the different materials of the organic layer and the inorganic layer, the bonding force between the two is poor, so that the organic layer and the inorganic layer are easily peeled off from each other when the bendable display device is bent.
[0003] In order to improve the bonding force between the inorganic layer and the organic layer, a coupling agent can be placed between the two layers. However, the coupling agent has poor radiation resistance, making the light-emitting elements encapsulated by the packaging structure vulnerable to ultraviolet radiation damage.

Method used

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  • A display device and packaging method thereof
  • A display device and packaging method thereof
  • A display device and packaging method thereof

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Embodiment 1

[0035] The display device 200 provided by an exemplary embodiment of the present invention, such as figure 1 As shown, it includes a substrate 210 , a light-emitting element 220 , and a package structure 100 . The package structure 100 packages the light-emitting element 220 on the substrate 210 . The encapsulation structure 100 includes a first inorganic layer 10, a first organic layer 20 and a first adhesive layer 30, the first adhesive layer 30 is interposed and bonded between the first inorganic layer 10 and the first organic layer 20 , for bonding and connecting the first inorganic layer 10 and the first organic layer 20, the first adhesive layer 30 is formed by mixing polyvinylidene fluoride and N-methylpyrrolidone, and the first adhesive layer effectively improves the second The bonding force between the inorganic layer 10 and the first organic layer 20 prevents the first inorganic layer 10 and the first organic layer 20 from peeling off when the packaging structure 100...

Embodiment 2

[0059] Another exemplary embodiment of the present invention provides a packaging method for the display device in the above-mentioned embodiment 1, such as image 3 shown, including the following steps:

[0060] S1: forming a first inorganic layer on a substrate mounted with a light emitting element, the first inorganic layer covering the light emitting element;

[0061] S2: a first adhesive layer formed by mixing polyvinylidene fluoride and N-methylpyrrolidone covers the first inorganic layer;

[0062] S3: forming the first organic layer on the first adhesive layer, the first organic layer covering the first adhesive layer.

[0063] By forming the first bonding layer between the first inorganic layer and the first organic layer, the first inorganic layer and the first organic layer are bonded together, thereby improving the binding force between the two. Certainly, the light-emitting element in the embodiment of the present invention may be a light-emitting layer, specific...

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Abstract

The display device provided by the present invention includes a substrate, a light-emitting element, and a packaging structure, and the packaging structure encapsulates the light-emitting element on the substrate; the packaging structure includes a first inorganic layer, a first adhesive layer, and a first An organic layer; the first bonding layer is interposed and bonded between the first inorganic layer and the first organic layer; the first bonding layer is composed of polyvinylidene fluoride and N-methylpyrrolidone The combination can effectively improve the bonding force between the first inorganic layer and the first organic layer, and prevent the first inorganic layer and the first organic layer from peeling off when the packaging structure is bent, so as to improve the packaging reliability of the packaging structure.

Description

technical field [0001] The invention relates to the field of display technology, in particular to a display device and a packaging method thereof. Background technique [0002] In current bendable display devices, such as OLED flexible displays, the packaging is usually formed in the form of stacking organic layers and inorganic layers. However, due to the different materials of the organic layer and the inorganic layer, the bonding force between the two is poor, so that the organic layer and the inorganic layer are easily peeled off from each other when the bendable display device is bent. [0003] In order to improve the binding force between the inorganic layer and the organic layer, a coupling agent can be provided between the two layers. However, the coupling agent has poor radiation resistance, so that the light-emitting element encapsulated by the packaging structure is easily damaged by ultraviolet radiation. Contents of the invention [0004] In order to improve ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L27/32
CPCH10K59/88H10K59/00
Inventor 孙丹丹葛泳来宇浩曹婷婷
Owner YUNGU GUAN TECH CO LTD