Thermosetting electroconductive adhesive

Abstract

In the past, it was necessary to add many electroconductive particles in order to improve electroconductivity, and adding many particles caused the initial viscosity to rise and made it difficult to stabilize storage stability. In the present invention, however, selecting monomers makes it possible to improve the electroconductivity even if many electroconductive particles are not added, and usingspecific electroconductive particles makes it possible to stabilize the storage stability. A thermosetting electroconductive adhesive including components (A)-(D), wherein the component (A) is an oligomer having (meth)acryl groups, the component (B) is monomers having one methacryl group in the molecule, the component (C) is an organic peroxide having a specific structure, and the component (D) is electroconductive particles surface-treated by stearic acid.

Description

technical field [0001] The present invention relates to a thermosetting isotropic conductive adhesive. Background technique [0002] In a thermosetting composition composed of an oligomer having a (meth)acryloyl group and a monomer, it is known to use a stabilizer such as a polymerization inhibitor as a means of maintaining storage stability. (Hereinafter, an acryloyl group and a methacryloyl group are also called a (meth)acryloyl group). However, it is known that if the stabilizer is excessively introduced, the curability is lowered, and in the worst case, no cure occurs. In addition, in a conductive adhesive such as JP 2000-53733 A, if a large amount of conductive particles such as silver powder is contained, metal ions will affect the peroxide, so gelation will easily occur. In particular, when stored in a non-air-permeable container, there is a problem that gelation occurs in a short period of time. This is because, in the curing form of the (meth)acrylic resin compos...

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