Uniform speed slicing device for polycrystalline silicon ingot processing

Abstract

The invention relates to the technical field of polycrystalline silicon processing equipment, in particular to a uniform speed slicing device for polycrystalline silicon ingot processing. The uniformspeed slicing device for polycrystalline silicon ingot processing comprises a processing table and a plurality of supporting feet installed at the lower end of the processing table; two supporting bases are symmetrically installed at the upper end of the processing table; supporting columns are installed at the upper ends of the supporting bases; a top plate is arranged at the upper ends of the supporting columns; the lower end of the top plate is provided with a slicing device body through a plurality of electric hydraulic rods; and a fixing assembly is arranged below the slicing device body,and is installed at the upper end of the processing table. The uniform speed slicing device for polycrystalline silicon ingot processing overcomes the defects in the prior art, is reasonable in design and compact in structure, and effectively solves the problems that traditional mortar cutting is large in environment pollution, surface damage is large during cutting, the propelling speeds are notconsistent, and consequently lots of scratches exist on the cut faces of polycrystalline silicon chips.

Description

technical field [0001] The invention relates to the technical field of polysilicon processing equipment, in particular to a uniform-speed slicing device for processing polysilicon ingots. Background technique [0002] Polysilicon is a form of elemental silicon. When molten elemental silicon is solidified under supercooled conditions, silicon atoms are arranged in the form of diamond lattices to form many crystal nuclei. If these crystal nuclei grow into crystal grains with different crystal plane orientations, these crystal grains combine to crystallize into polycrystalline silicon. . [0003] Polysilicon has a wide range of utilization values. From the current development process of international solar cells, it can be seen that its development trend is monocrystalline silicon, polycrystalline silicon, ribbon silicon, and thin film materials (including microcrystalline silicon-based thin films, compound-based thin films and dye thin films). [0004] The existing polysilic...

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Problems solved by technology

[0007] Aiming at the deficiencies of the prior art, the present invention provides a uniform-speed slicing device for processing polycrystalline silicon ingots, which overcomes the deficiencies of the prior art, has a reasonable design and a compact structure, and effectively solves the problem of traditional mortar cutting, which not only pollutes the environment but also Moreover, the surface damage is large and the speed of advancement is different during cutting, which leads to the problem of more scratches on the cutting surface of polycrystalline silicon wafers.

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