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An infrared focal plane array chip automatic testing equipment

An automated testing, infrared focal plane technology, applied in electrical components, conveyor objects, transportation and packaging, etc., can solve problems such as low production efficiency, inability to meet large-scale and efficient production, and achieve accurate positioning and improve test efficiency.

Active Publication Date: 2021-02-26
哈工大机器人(山东)智能装备研究院
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] At present, infrared focal plane array chips are mainly tested by manually placing a single chip into the test system, and the model number of the test chip is observed by human eyes and the test results are recorded accordingly. Low, unable to meet the needs of large-scale and efficient production

Method used

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  • An infrared focal plane array chip automatic testing equipment
  • An infrared focal plane array chip automatic testing equipment
  • An infrared focal plane array chip automatic testing equipment

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Embodiment Construction

[0059] In order to make the purpose, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments It is a part of embodiments of the present invention, but not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0060]In the description of this application, it is to be understood that the terms "central", "longitudinal", "transverse", "front", "rear", "left", "right", "vertical", "horizontal", The orientations or positional relationships indicated by "top", "bottom", "inner", "outer", etc. are based on the orientations or positional relationships sho...

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Abstract

The invention relates to automatic testing equipment for an infrared focal plane array chip. The automatic testing equipment comprises a main unit body; a test station system used for testing a to-be-detected chip; a charging tray automatic feeding device which is used for storing the to-be-detected chip through a material tray and can move the charging tray from a feeding area a to a to-be-detected area b; a chip mechanical arm feeding and picking device which is used for grabbing the to-be-detected chip from the charging tray automatic feeding device and placing the to-be-detected chip on the test station system; a charging tray automatic discharging device which is used for storing the detected chip and can move the charging tray from a sorting area c to a discharging area d; a chip mechanical arm sorting and picking device which is used for grabbing the detected chip from the test station system and placing the chip in the charging tray in the sorting area c; an empty tray conveying device which is used for moving an empty tray to the automatic tray discharging device; and a control system. According to the invention, the manual work is replaced by automatic testing, positioning is accurate, and the testing efficiency can be greatly improved.

Description

technical field [0001] The invention relates to the field of semiconductor optoelectronics and automatic production equipment, in particular to an infrared focal plane array chip automatic testing equipment. Background technique [0002] Infrared imaging technology is more and more widely used in industrial sensing, image monitoring, automobile industry, fire search and rescue, and even military navigation and night vision. As a key component of infrared systems and thermal imaging devices, infrared focal plane array chips need to go through performance testing from design to processing and manufacturing to packaging and marketing. Performance parameters such as element response voltage, element voltage response rate, and element noise voltage are tested. Tested to ensure that its performance parameters are up to standard. [0003] At present, infrared focal plane array chips are mainly tested by manually placing a single chip into the test system, and the model number of t...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/677H01L21/68H01L21/687
Inventor 戈锐王鹏黄强刘宝龙权五云褚博
Owner 哈工大机器人(山东)智能装备研究院