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Highly rigid low water-absorbent PA/ABS alloy material and preparation method thereof

A low water absorption, alloy material technology, applied in the field of alloy materials, can solve the problems of low water absorption, bending and impact resistance, short molding cycle, insufficient rigidity, etc., to achieve good comprehensive performance, low water absorption, solve rigidity Insufficient effect

Inactive Publication Date: 2019-05-07
JINYOUNG XIAMEN ADVANCED MATERIALS TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] In order to solve the deficiencies mentioned in the above-mentioned prior art, the present invention provides a high rigidity and low water absorption PA / ABS alloy material and its preparation method. Insufficient technical problems, and has excellent crystallization speed, the material of the present invention has a short molding cycle, and does not need to carry out high mold temperature or annealing treatment on the product; low water absorption, bending and impact resistance, suitable for thin-walled structures of portable electronic instruments

Method used

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  • Highly rigid low water-absorbent PA/ABS alloy material and preparation method thereof
  • Highly rigid low water-absorbent PA/ABS alloy material and preparation method thereof
  • Highly rigid low water-absorbent PA/ABS alloy material and preparation method thereof

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Embodiment 1

[0034] Taking Example 1 as an example, its preparation method comprises:

[0035] Step a, drying the polyamide MXD6 and ABS resin in a dehumidifier at 100°C for 6-8 hours, and controlling the moisture content to be less than 0.03%;

[0036] Step b, weighing the dried polyamide MXD6 and ABS resin, and toughening agent, compatibilizer, nucleating agent and processing aid according to the weight ratio, adding them to a high mixer and mixing for 2-5 minutes;

[0037] Step c. Send the mixed raw materials in step b into a twin-screw extruder for melting and plasticization, kneading and mixing, and finally extrude through the machine head, draw strands, cool, pelletize, and dry to obtain high-rigidity PA / ABS alloy material.

[0038] Wherein, the aspect ratio of the twin-screw extruder adopted is 40:1;

[0039] The screw speed is 350-400rpm;

[0040] The processing temperatures of each section of the twin-screw extruder are: the temperature of the first zone is 220-240°C, the temp...

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Abstract

The present invention relates to the field of alloy materials, and more particularly to a highly rigid low water-absorbent PA / ABS alloy material and a preparation method thereof. The highly rigid lowwater-absorbent PA / ABS alloy material is prepared from the following raw materials in parts by weight: 35-65 parts of polyamide MXD65, 40-60 parts of ABS resin, 0.2-0.5 part of nucleating agent, 10-20parts of flexibilizer, 1-5 parts of compatilizer, and 0.5-1.5 parts of processing aid, wherein the polyamide MXD6 is a polyamide resin obtained by the condensation polymerization of m-xylylenediamineand a straight-chain aliphatic alpha,omega-diacid or an aromatic diacid. The highly rigid low water-absorbent PA / ABS alloy material provided by the present invention has good overall performance andcan be used for solving the technical problem of insufficient rigidity of the existing PA / ABS alloy material; and the PA / ABS alloy material has outstanding crystallization rate, low water absorption,bendability and impact resistance, and is particularly suitable for a thin-wall structure of a portable electronic instrument.

Description

technical field [0001] The invention relates to the field of alloy materials, in particular to a PA / ABS alloy material with high rigidity and low water absorption and a preparation method thereof. Background technique [0002] With the advancement of science and technology, portable electronic instruments have attracted much attention. Due to the characteristics of use, there are parts that need to support the internal structure and meet rigidity in such instruments, such as the inner panel that supports the keys on the inside of the keyboard, the frame of the liquid crystal display panel, etc. Components need to meet properties such as thin wall, high rigidity, low bending and impact resistance, and also have high requirements for lightweight and insulation. [0003] Polyamide is one of the five major engineering plastics, referred to as PA (Polyamide), which has excellent solvent resistance, high mechanical strength, and easy injection molding processing, but its dimension...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L77/06C08L55/02C08L51/00C08K13/02C08K3/34C08K3/38C08K3/26C08K5/098
Inventor 范丽园刘凯
Owner JINYOUNG XIAMEN ADVANCED MATERIALS TECH CO LTD
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