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Array substrate and display device

A technology for array substrates and display areas, applied to semiconductor devices, electrical components, circuits, etc., can solve problems such as package failure, lower OLED display quality, and package layer shedding, so as to reduce the degree of heat accumulation and reduce the risk of peeling off. The effect of good thermal performance

Active Publication Date: 2021-01-26
BOE TECH GRP CO LTD +1
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

For example, for an OLED (Organic Light Emitting Diode) display panel, if the encapsulation fails, external water and oxygen will invade the display area of ​​the display panel, resulting in failure of the organic light emitting material and reducing the display quality of the OLED.
[0003] The display panel is prone to packaging failure problems on the pad side, for example, the packaging layer is prone to peeling off at the electrode leads, and the gap between the electrode leads and the peeled packaging layer will form a path for water and oxygen erosion, resulting in water and oxygen intrusion into the display area, causing package failure

Method used

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  • Array substrate and display device
  • Array substrate and display device

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Embodiment Construction

[0031] Example embodiments will now be described more fully with reference to the accompanying drawings. Example embodiments may, however, be embodied in many forms and should not be construed as limited to the examples set forth herein; rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the concept of example embodiments to those skilled in the art. The described features, structures, or characteristics may be combined in any suitable manner in one or more embodiments. In the following description, numerous specific details are provided in order to give a thorough understanding of embodiments of the present disclosure.

[0032] In the drawings, the thicknesses of regions and layers may be exaggerated for clarity. The same reference numerals in the drawings denote the same or similar structures, and thus their detailed descriptions will be omitted.

[0033] When a structure is "on" another structure, it may me...

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Abstract

The disclosure provides an array substrate and a display device, which belong to the field of display technology. The array substrate includes a display area and a peripheral area, the display area is provided with a common electrode, and the peripheral area is provided with an electrode bus line close to the display area; the array substrate also includes a first electrode pad, a first conductive part, The second electrode pad and the second conductive part; wherein, the first electrode pad is arranged on the side of the peripheral area away from the display area; the first conductive part is connected to the first electrode pad and the common electrode The second electrode pad is located on the side of the peripheral area away from the display area; the second conductive part is connected to the second electrode pad and extends in a direction away from the first conductive part to the The electrode bus connection described above. The array substrate and the display device provided by the present disclosure can reduce the risk of delamination of the encapsulation layer at this position, and improve the yield rate of the array substrate encapsulation.

Description

technical field [0001] The present disclosure relates to the field of display technology, and in particular to an array substrate and a display device. Background technique [0002] Display panels need good packaging to maintain the stability of internal materials. For example, for an OLED (Organic Light Emitting Diode) display panel, if the encapsulation fails, external water and oxygen will invade the display area of ​​the display panel, resulting in failure of the organic light emitting material and reducing the display quality of the OLED. [0003] The display panel is prone to packaging failure problems on the pad side, for example, the packaging layer is prone to peeling off at the electrode leads, and the gap between the electrode leads and the peeled packaging layer will form a path for water and oxygen erosion, resulting in water and oxygen intrusion into the display area, causing package failure. [0004] The above information disclosed in this Background section...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L27/32
CPCH01L27/124H10K59/131H01L27/1244H10K59/124
Inventor 张震刘庭良
Owner BOE TECH GRP CO LTD