Printed circuit-type heat exchanger having integral structure

A technology of printed circuit boards and heat exchangers, applied in the direction of heat exchanger fixation, printed circuit components, circuit heating devices, etc., can solve the problems of heat loss, pressure, loss, etc., to reduce the number of parts, simplify the structure, and shorten the production the effect of time

Active Publication Date: 2019-05-14
DOOSAN HEAVY IND & CONSTR CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0021] As another way to solve this problem, multiple printed circuit board heat exchanger modules can be connected in parallel, but at this time, the problem of connecting piping and the accompanying heat loss and pressure loss will still occur

Method used

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  • Printed circuit-type heat exchanger having integral structure
  • Printed circuit-type heat exchanger having integral structure
  • Printed circuit-type heat exchanger having integral structure

Examples

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Embodiment Construction

[0073] Preferred embodiments of the present invention will be described in detail below in conjunction with the accompanying drawings. It should be mentioned here that the interpretation of the terms or words used in this specification and claims should not be limited to the usual meaning or dictionary meaning, but should be interpreted in accordance with the meaning and concept of the technical idea of ​​the present invention.

[0074] Throughout this specification, when it is referred to that a certain member is located “on” another member, it includes not only a case where a certain member touches another member, but also a case where another member exists between the two members. Throughout this specification, when it is stated that a certain part "comprises" a certain constituent element, it means that other constituent elements can be included without excluding other constituent elements, unless the contrary content is specifically stated.

[0075] Figure 6 is a perspe...

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PUM

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Abstract

A printed circuit-type heat exchanger having an integral structure is disclosed. The heat exchanger includes first channel plates configured such that a fluid path for fluid A is formed on one surfacethereof, extending towards two side directions, inflow and outflow parts for fluid A are formed on the fluid path for fluid A, and structures corresponding to inflow and outflow portions for fluid Bare formed on two sides; second channel plates configured such that a fluid path for fluid B intersecting with the fluid path for fluid A is formed on one surface of the second channel plates, and theinflow and outflow portions for fluid B are formed on two ends of the fluid path for fluid B; an upper plate attached to an upper surface of a fluid channel stack structure formed by alternately stacking two or more first and second channel plates on one another; and a lower plate mounted to the lower surface of the fluid channel stack structure.

Description

technical field [0001] The present invention relates to a Printed Circuit Type Heat Exchanger, and more particularly, the Printed Circuit Type Heat Exchanger includes an integral structure and has a structure that eliminates dead space. Background technique [0002] The prior art shell-and-tube heat exchangers are unfavorable in terms of heat transfer area per unit volume, requiring a shell large enough to accommodate thermal expansion, and heavy and heavy to handle a certain degree of heat exchange capacity. great equipment. [0003] In particular, heat exchangers for LNG ships are required to have a certain degree of heat exchange capacity and occupy a small volume. [0004] Therefore, the shell-and-tube heat exchanger in the prior art is difficult to be applied to LNG ships and the like due to its large volume and heavy weight. [0005] Moreover, the maintenance of the conventional shell-and-tube heat exchanger is not easy, and a crane with a larger capacity, a handling...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): F28D9/00
CPCF28F2210/10F28F3/048F28D9/0037F28D9/005F28D9/0056F28D9/0068F28D9/0075F28D2021/0033F28F2275/06F28F9/0221H05K1/0272F28F3/086H05K1/0201
Inventor 梁基训金正吉宣七领郑仁徹
Owner DOOSAN HEAVY IND & CONSTR CO LTD
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