Electronic device water cooling system drive pump

Abstract

The invention belongs to the technical field of heat dissipation cooling, and particularly relates to an electronic device water cooling system drive pump. A pump cover and a pump body are provided with inlet and outlet valves composed of butterfly valves. The pump cover is arranged on the pump body. Energy converters are in pressing joint in body cavities of the pump body through pump cover bodytables and seal rings. Each energy converter is composed of an elastic ring and piezoelectric vibrators pasted to the two sides of the elastic ring, wherein each piezoelectric vibrator is formed by pasting a base plate and a piezoelectric plate. Upper pump cavities are formed by the energy converters, the seal rings and the pump cover, lower pump cavities are formed by the energy converters, the seal rings and the pump body, and the upper pump cavities connected in parallel and the lower pump cavities connected in parallel are connected in series. At least one piezoelectric vibrator comprisesa driver and a sensor, a power source outputs the same direct current drive voltage signals to the piezoelectric vibrators and the driver, sensing voltage signals generated by the sensor are utilizedfor judging the piezoelectric vibrator deformation state, and when the sensing voltage reaches the extreme value, the drive voltage of the power source and the piezoelectric vibrator deformation direction are reversed, and piezoelectric vibrator reciprocated bending vibration and fluid one-way flowing are formed through alternated reversing of the drive voltage.

Description

technical field [0001] The invention belongs to the technical field of heat dissipation and cooling, and in particular relates to a driving pump for an electronic device water cooling system. Background technique [0002] In recent years, with the improvement of the integration and miniaturization of sub-products, as well as the continuous improvement of the operating speed and configuration density of electronic components such as chips and integrated circuits, the internal ventilation performance of electronic equipment is continuously declining, and the development of electronic components The heat is constantly rising, and cooling methods such as traditional fans and external heat sinks can no longer meet the actual needs. The cooling and heat dissipation effect of the internal components of electronic equipment has become a key factor restricting its reliability and operational stability. Based on this, people have successively proposed a variety of new air-cooled and w...

AI Technical Summary

Problems solved by technology

Due to the limited fluid pressure and fluid circulation capacity formed by the proposed micro fan and micro pumping system, and the unsatisfactory heat dissipation and cooling effect, there are certain limitations in practical application. The pressure is greatly affected by the working conditions. Fluid viscosity, temperature and output pressure affect the resonant frequency of the pump by affecting the system damping. When the resonant frequency of the piezoelectric vibrator under specific working conditions deviates greatly from the set excitation frequency, The output flow and pressure of the pump will drop significantly

Therefore, the output performance of the piezoelectric pump at a fixed frequency is not ideal, and the accuracy of the output flow and pressure calculated according to the set driving voltage and frequency is also low; in addition, most of the existing piezoelectric pumps use cantilever beam type The cut-off valve has poor flatness and cut-off effect, which seriously affects the output flow and pressure of the pump

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