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A manufacturing process of buried copper block board

A technology of burying copper blocks and copper blocks, which is applied in printed circuit manufacturing, printed circuits, electrical components, etc., can solve problems such as reducing defective rates

Active Publication Date: 2021-07-06
KINWONG ELECTRONICS TECH LONGCHUAN
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The technical problem to be solved by the present invention is how to improve the flatness of the board, avoid warping of the board during the laser conformask process, and reduce the defective rate

Method used

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  • A manufacturing process of buried copper block board

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Embodiment Construction

[0018] The technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention, and similar component numbers in the drawings represent similar components. Apparently, the embodiments described below are only a part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without creative efforts fall within the protection scope of the present invention.

[0019] It should be understood that when used in this specification and the appended claims, the terms "comprising" and "comprises" indicate the presence of described features, integers, steps, operations, elements and / or components, but do not exclude one or Presence or addition of multiple other features, integers, steps, operations, elements, components and / or col...

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Abstract

The invention discloses a method for manufacturing a copper-buried PCB board, and relates to the technical field of PCB board manufacturing. The method includes the following steps in sequence: pressing→edge milling→drilling circuit alignment holes→conformask outer layer circuit→inner layer etching→inner layer AOI→tearing protective film→cutting excess glue→laser drilling, in the pressing step , the protective film is at the bottom of the PCB board. The present invention adjusts the overflow glue process that affects board warping to the conformask outer layer circuit, effectively avoids the board warping problem during circuit production, reduces production difficulty; solves the quality problem of poor exposure in the original conventional process, and improves Product yield.

Description

technical field [0001] The invention relates to the technical field of circuit manufacturing of PCBs, in particular to a manufacturing process of a buried copper block board. Background technique [0002] The circuit production of conventional PCB boards is to paste a layer of photosensitive material on the PCB substrate, and use the UV light emitted by the exposure lamp in the exposure machine to trigger the reaction of the photosensitive initiator in the photosensitive material to achieve selective partial bridge polymerization. Hardening effect, so as to achieve the purpose of graphic transfer. [0003] At present, there are two types of exposure machines in the PCB industry, one is a conventional vacuum-type manual or CCD automatic exposure machine, and the other is a non-vacuum type laser direct imaging LDI exposure machine. The difference between the two is: the former needs to use negative film as a tool for graphic transfer, the tool will expand with heat and contra...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K3/00H05K3/06
Inventor 张柏勇张鸿伟蓝春华姚承林
Owner KINWONG ELECTRONICS TECH LONGCHUAN
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