Method and semi-finished product structure for reducing package substrate warpage

Abstract

The invention discloses a method for reducing warpage of a package substrate and a semi-finished structure, wherein the method for reducing warpage of the package substrate comprises a preparation step, a packaging step and a laser cutting step. By cutting a first slit in the insulating sealant layer of the package substrate by a laser device in the laser cutting step, the stress of the package substrate is destroyed, thereby reducing the warpage of the package substrate.

Description

technical field [0001] The invention relates to a method and a semi-finished structure, in particular to a method for reducing the warping of a packaging substrate and a semi-finished structure. Background technique [0002] Electronic products are developing towards thinner and smaller, and electronic packaging is also developing towards the same trend. The packaging substrate used to carry chips is also getting thinner and thinner. Due to the difference in thermal expansion coefficient of the material properties in each semiconductor component, it will lead to package warping ( Warpage) and stress (Stress), which will affect the yield of semiconductor packaging. There must be a heat treatment step in the semiconductor packaging process, especially the thinner electronic packaging structure. The thinner packaging substrate is formed in one packaging substrate strip. Because of its weak rigidity, it is easier to be affected by temperature changes during manufacturing. The s...

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Problems solved by technology

There must be a heat treatment step in the semiconductor packaging process, especially the thinner electronic packaging structure. The thinner packaging substrate is formed in one packaging substrate strip. Because of its weak rigidity, it is easier to be affected by temperature changes during manufacturing. The stress generated under the environment will cause warpage and deformation of the packaging substrate strip, which may cause damage to electronic components and difficulty in subsequent processing operations.

Furthermore, in the circuit layout of the packaging substrate, it is usually impossible to maintain an average wiring density. In some areas, the metal distribution lines are dense, and in some places, the lines are very sparse.

In the packaging process, such regional circuit density deviations and the materials of the substrate and the sealant have different thermal expansion coefficients. Glue injection molding) will cause the packaging substrate to be easily deformed and warped (warpage), resulting in the inability to accurately cut and separate the semi-finished products of the packaging substrate into multiple single packaging structures, resulting in a decrease in yield

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