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Batch attachment method for electronic paper

An electronic paper, paper batch technology, applied in chemical instruments and methods, lamination devices, lamination auxiliary operations, etc., can solve the problems of long indwelling time, low production capacity, low efficiency, etc., to reduce the indwelling time and the finished product. The effect of defect rate and improving production capacity

Active Publication Date: 2019-05-24
江西兴泰科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The existing attachment process is to first cut the TFT glass raw material and the electronic paper raw material into small pieces, and then attach the small piece of TFT glass and the small piece of electronic paper together. In this attachment method, the electronic paper raw material It takes a long time before the material is cut into small pieces and bonded with TFT glass, which leads to the average display effect of the final product. At the same time, since the e-paper and TFT glass are bonded one by one, it also leads to low efficiency. Low, production capacity is low, so it is necessary to improve the existing attachment method

Method used

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  • Batch attachment method for electronic paper
  • Batch attachment method for electronic paper
  • Batch attachment method for electronic paper

Examples

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Embodiment Construction

[0029] Such as Figure 1 to Figure 9 As shown, a method for attaching electronic paper in batches comprises the following steps:

[0030] S1. Bonding the original material: the electronic paper original material (large sheet) and the waterproof protective film original material (large sheet) are bonded together to form the substrate 3, and the waterproof protective film original material is located on the upper side of the electronic paper original material; The paper raw material is used to cut out multiple small pieces of electronic paper 1, and the waterproof protective film raw material is used to cut out multiple small pieces of waterproof protective film 2;

[0031] S2. Cutting earholes: using laser to cut multiple earholes 31 on the base material 3, the multiple earholes 31 are arranged in rows and run through the base material 3, and then the base material is cleaned;

[0032] S3. Cutting the outline of the electronic paper: Turn over the substrate 3 so that one side ...

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PUM

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Abstract

The invention provides a batch attachment method for electronic paper. The method comprises the following steps that step one, an original electronic paper material fits an original water-proof protection film material; step two, earholes are cut; step three, only the original electronic paper material is cut; step four, water-proof protection film is cut in layers, and a lower separation-type layer remains; step five, a waste material area on electronic paper is stripped; step six, the electronic paper fits an original TFT glass material (a large sheet); step seven, a waste material area on the water-proof protection film is stripped; step eight, TFT glass is cut into products. The multiple pieces of electronic paper and the original glass material achieve one-time batch attachment, the attachment time is short, the attachment efficiency is high, and therefore the display effect of the products can be ensured, and the production capacity can be improved.

Description

technical field [0001] The invention relates to the technical field of electronic paper production, in particular to a method for attaching electronic paper in batches. Background technique [0002] Electronic shelf labels made of electronic paper have been widely used in major supermarkets around the world. Electronic shelf labels generally include electronic paper and TFT glass bonded together. Since the electronic ink layer material in electronic paper is relatively sensitive, it is difficult to tear When the aluminum film layer 3S-6S on the e-paper is removed, the temperature and humidity of the environment where the e-paper is located determines the display effect of the finished product at high and low temperatures of the terminal, so it is necessary to bond the e-paper and TFT glass together as soon as possible. The existing attachment process is to first cut the TFT glass raw material and the electronic paper raw material into small pieces, and then attach the small ...

Claims

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Application Information

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IPC IPC(8): B32B37/00B32B37/10B32B38/00B32B38/04B32B38/18
Inventor 佘勇肖绪名
Owner 江西兴泰科技有限公司
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