Conductive adhesive dropping system and conductive adhesive dropping method

Abstract

A conductive adhesive dripping system and a conductive adhesive dripping method. An induction coil (20) is sleeved on a dripper (10), and a processing unit (30) electrically connected to the induction coil (20) is provided; the induction coil (20) is located outside one end of the dripper (10) provided with an outlet (111) of a conductive adhesive channel (11); the processing unit (30) energizes the induction coil (20) so as to enable same to generate a magnetic field; when a conductive adhesive (8) drips from the outlet (111) of the conductive adhesive channel (11) of the dripper (10), the magnetic field is changed, causing a change in the current of the induction coil (20); and in this case, the processing unit (30) acquires the position coordinates of the dripper (10), and when the position coordinates are preset specified coordinates, determines that the dripper (10) performs a normal dripping operation, otherwise, determines that the dripping of the dripper (10) is abnormal, so as to give an alarm. The invention can effectively monitor the dripping position of the conductive adhesive (8).

Description

technical field [0001] The invention relates to the field of display technology, in particular to a conductive glue dropping system and a conductive glue dropping method. Background technique [0002] In the field of display technology, flat panel display devices such as liquid crystal display devices (Liquid Crystal Display, LCD) have gradually replaced cathode ray tube (Cathode Ray Tube, CRT) display devices. The liquid crystal display device has many advantages such as a thin body, power saving, and no radiation, and has been widely used. [0003] Most of the liquid crystal display devices currently on the market are backlight liquid crystal display devices, which include a liquid crystal display panel and a backlight module. Generally, a liquid crystal display panel consists of a color filter (Color Filter, CF) substrate, a thin film transistor (Thin Film Transistor, TFT) array substrate, a liquid crystal (Liquid Crystal, LC) and a sealant sandwiched between the color f...

AI Technical Summary

Problems solved by technology

The biggest problem of the conductive adhesive 300 during use is the problem of electrostatic discharge (ESD). Specifically, if the conductive adhesive 300 does not need to be placed above the array substrate wiring 120 in the design, it is limited by the amount of the conductive adhesive 300. During the dripping process, when the abnormal glue rejection occurs so that the conductive glue 300 is just above the array substrate wiring 120, the distance between the conductive glue 300 and the array substrate wiring 120 is shorter than the distance between the array substrate wiring 120 and the common electrode layer 220. The distance between them is much smaller, and electrostatic discharge between different potentials is likely to be caused at the position where the conductive adhesive 300 is opposite to the array substrate wiring 120, and the more severe the extrusion of the conductive adhesive 300, the more likely it is to cause electrostatic discharge. When the phenomenon is serious, the conductive ball 310 in the conductive glue 300 will break through the insulating layer 130 and contact the array substrate wiring 120, causing a short circuit between the array substrate wiring 120 and the common electrode layer 220, affecting the normal operation of the liquid crystal display panel. Work

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