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Display panel

A display panel and display area technology, applied in semiconductor devices, electrical components, circuits, etc., can solve the problems of aging and failure of light-emitting materials of organic light-emitting units, affecting the life of display panels, etc.

Active Publication Date: 2019-05-24
KUNSHAN GO VISIONOX OPTO ELECTRONICS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Due to the thin film encapsulation layer, water vapor and oxygen in the external environment are easy to diffuse from the interface between the encapsulation layers to the inside of the display panel, resulting in the aging failure of the light-emitting material of the organic light-emitting unit and affecting the life of the display panel.

Method used

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Embodiment Construction

[0035] The present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the present invention, but not to limit the present invention. In addition, it should be noted that, for the convenience of description, only some structures related to the present invention are shown in the drawings but not all structures.

[0036] figure 1 A schematic cross-sectional structure diagram of a display panel provided by an embodiment of the present invention, as shown in figure 1 As shown, the display panel includes a substrate 11 , an organic light emitting unit 12 and a thin film encapsulation layer 130 . The substrate 11 includes a display area 10 and a non-display area 20 , the organic light emitting unit 12 is disposed on the display area 10 of the substrate 11 , and the thin film encapsulation layer 130 covers the organic light emi...

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Abstract

The invention discloses a display panel. The display panel comprises a substrate, an organic light-emitting unit and a thin film packaging layer. The substrate comprises a display area and a non-display area. The organic light-emitting unit is arranged in the display area of the substrate, and the thin film packaging layer covers the organic light-emitting unit. The thin film packaging layer at least comprises a first inorganic layer and a second inorganic layer. The thin film packaging layer covers the organic light-emitting unit. The display panel also includes a sealing member disposed around the display area. The sealing member is between the first inorganic layer and the second inorganic layer in the non-display area, and in contact with the first inorganic layer and the second inorganic layer. Through the melting and re-solidifying of the sealing member, the bonding between the first inorganic layer, the second inorganic layer and the sealing member can be enhanced. Therefore, water vapor and oxygen in the external environment can be prevented from diffusing into the display panel from an interface within the thin film packaging layer. The packaging effect of the thin film packaging layer is improved. The aging and the failure of light-emitting materials of the organic light-emitting unit are avoided, and the service life of the display panel is prolonged.

Description

technical field [0001] Embodiments of the present invention relate to the field of display technologies, and in particular, to a display panel. Background technique [0002] An organic light emitting diode (Organic Light Emitting Diode, OLED) display device has become an important display device in the display field due to its advantages of thinness, lightness, wide viewing angle, and low cost. [0003] Components such as water vapor and oxygen in the air have a great impact on the life of the light-emitting unit in the OLED display panel. Therefore, when forming an OLED display panel, an encapsulation layer covering the light-emitting unit is provided to prevent components such as water vapor and oxygen from entering the interior of the display panel. , to avoid water vapor and oxygen and other components from damaging the light-emitting unit. In the prior art, the encapsulation layer generally adopts a Thin-Film Encapsulation (TFE) layer, and the widely used TFE layer is ...

Claims

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Application Information

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IPC IPC(8): H01L51/52
Inventor 周志伟
Owner KUNSHAN GO VISIONOX OPTO ELECTRONICS CO LTD
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