Patents
Literature
Patsnap Eureka AI that helps you search prior art, draft patents, and assess FTO risks, powered by patent and scientific literature data.

5results about How to "Avoid aging failure" patented technology

LED electrode and chip

ActiveCN222639009UAvoid affecting the lineAvoid aging failureThin membraneMechanical engineering
The utility model discloses an LED electrode and a chip. The LED electrode comprises a first adhesion layer, a functional layer, a conductive layer, a spacing layer and a bonding wire layer, wherein the first adhesion layer is used for adhering to an epitaxial structure; the functional layer is used for protecting the first adhesion layer; the functional layer comprises a single-layer structure or a multi-layer structure, when the functional layer is of the multi-layer structure, a metal medium of the functional layer is at least two of Ti, Pt, Ni, W, W alloy and Al-Cu alloy, and the thickness of the functional layer is 1-5 microns; when the functional layer is of a single-layer structure, the metal medium of the functional layer is one of Ti or Ni metal films, and the thickness of the functional layer is # imgabs0 #. According to the utility model, the spacing layer is arranged between the conductive layer and the bonding wire layer to separate the conductive layer from the bonding wire layer, so that the problems of poor eutectic and too small thrust value between the bonding wire layer and the bonding wire under the bonding wire condition of normal pressure and within 200 DEG C are avoided, and the service life of the bonding wire layer is prolonged. And therefore, the practical application problems of off-line, poor contact and the like are solved.
Owner:JIANGXI ZHAO CHI SEMICON CO LTD

An air energy coil assembly

ActiveCN224623205Ufit tightlyAvoid aging failure
This utility model belongs to the field of air source heat pump coil technology, specifically referring to an air source heat pump coil assembly, including a shell and a single tube. The shell has a cylindrical hollow structure, and a fixing plate is installed on the top of the shell. The fixing plate is horizontally covered on the top of the shell, and the fixing plate has through holes. Two sets of through holes are arranged symmetrically, and connecting components are installed in the corresponding through holes. The single tube passes through the connecting components and the through holes. The two sets of single tubes pass through the two connecting components and the through holes respectively. The tube segments located inside the shell are spirally wound to form a coil. The connecting components include a threaded sleeve, a nut, and a trapezoidal rubber ring. Double sealing is achieved through the cooperation of the trapezoidal rubber ring and the elastic rubber ring. The annular step of the trapezoidal rubber ring and the annular convex edge of the elastic rubber ring form an interference fit, which can actively compensate for the aging gap of the rubber ring after long-term use. At the same time, the ease of assembly is significantly improved, and the installation time is greatly shortened.
Owner:BEIJING YIQIONG TECHNOLOGY CO LTD

Enclosed waterway single-parallel integrated power semiconductor module

The application belongs to the technical field of new energy automobile power electronic control, and particularly relates to a closed water channel single-parallel integrated power semiconductor module, which comprises six TPAK power units arranged in a single row and symmetrically along the length direction of a cold plate; three upper pipe TPAK power units and three lower pipe TPAK power units are alternately and symmetrically arranged to form a three-phase full bridge; a folded fin is arranged between the cold plate and a water channel plate, and the two sides of the folded fin are respectively connected with the inner surface of the cold plate and the inner surface of the water channel plate through vacuum brazing to form a closed water channel; the lower surface of a ceramic substrate of the TPAK power unit is connected with the upper surface of the cold plate through vacuum reflow soldering to form a continuous metal bonding layer; an independent temperature measuring plate is arranged above the top plastic package shell of the TPAK power unit, and the sensing surface of a temperature sensing element is elastically contacted with the surface of the top plastic package shell of the TPAK power unit through heat-conducting glue, so that a vehicle-grade integrated power brick structure without a flexible thermal interface material, a sealing ring and a fastener compression is realized.
Owner:ZHONGKE YICHUANG (GUANGZHOU) TECH CO LTD