Packaging shielding structure and electronic equipment

Abstract

The invention provides a shielding packaging structure and electronic equipment, and the shielding packaging structure comprises a substrate. At least two stacked first grounding layers are arranged in the substrate, and one surface of the substrate is provided with a second grounding layer. The second grounding layer is provided with grounding bonding pads arranged along the edge of the substrate. Moreover, grounding holes for electrically connecting the adjacent grounding layers are formed in the substrate, and the grounding holes are arranged in a circle around a plate body, and the distance between the adjacent grounding holes is smaller than a set distance, so that the grounding holes can form a good Faraday electric cage. A device is arranged on the other surface of the substrate, and a packaging layer for packaging the device is also arranged on the device. In addition, the structure also comprises a shielding layer wrapped by the packaging layer, and the shielding layer extendsto the substrate and is electrically connected with the first grounding layers. According to the scheme, the grounding resistance is reduced through the arranged grounding holes, and the electromagnetic shielding effect of the shielding layer is improved. Electromagnetic interference at the bottom of the substrate is avoided through the second grounding layer and the grounding bonding pad, and the shielding effect is improved.

Description

technical field [0001] The present application relates to the technical field of mobile terminals, in particular to a packaging and shielding structure and electronic equipment. Background technique [0002] With the development of SiP (System-in-Package, system-in-package) technology and the demand for miniaturization of mobile phones, packaging technology is used to integrate active modules and passive devices into a system at the packaging level to increase device integration. , thereby reducing the device area on the PCB and improving the integration and simplicity of the PCB. Using a large number of SiPs to make customized modules is also an important way for the current miniaturization of mobile phones. The grounding method and structure of the SIP shielding are very important. It is necessary to ensure that the grounding of the shielding layer and the substrate forms a good Faraday cage to form a good electromagnetic shielding. However, the grounding effect of the sy...

AI Technical Summary

Problems solved by technology

The grounding method and structure of the SIP shielding are very important. It is necessary to ensure that the grounding of the shielding layer and the substrate forms a good Faraday cage to form a good electromagnetic shielding. However, the grounding effect of the system-in-package in the prior art is not ideal, resulting in electromagnetic shielding less effective

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