Electromagnetic pulse welding system special for PCB welding

Abstract

The invention discloses an electromagnetic pulse welding system special for PCB welding. The electromagnetic pulse welding system special for PCB welding comprises a bearing base used for containing ato-be-welded PCB, an electromagnetic pulse welding assembly and a shield mold. The electromagnetic pulse welding assembly comprises a pulse power source, a coil and a plate magnetic collector, and the coil is located above the plate magnetic collector and connected with the pulse power source. The electromagnetic pulse welding assembly is arranged above the bearing base through an installation frame on the bearing base; and the shield mold is used for covering the back face of the PCB and made of a non-conductor material, the whole shield mold is a box cover capable of covering a bottom opening of the PCB, multiple non-shield channels vertically penetrating through the box cover are arranged in the box cover, and the non-shield channels correspond to welding points of the back face of theto-be-welded PCB one to one.

Description

technical field [0001] The invention relates to the technical field of electromagnetic pulse welding, in particular to a system for welding PCB boards by using the electromagnetic pulse welding technology. Background technique [0002] The production process of PCB is to design the drawing first, then print the drawing design on the printed circuit board to form pads with solder joints and formed circuits, and then install the electronic components on the pads and connect them to the pads. In an existing welding method, spherical pads are arranged in a two-dimensional array on the back of the printed circuit substrate, and holes for component insertion are opened on the printed circuit substrate. After the components are inserted into the holes, the solder joints between the pins and the basic back of the printed circuit Soldering, such as the grid array package is used in this way. [0003] However, no matter what kind of package soldering technology is used, the connectio...

AI Technical Summary

Problems solved by technology

There are many welding steps, so it is necessary to ensure that each step is qualified for product quality. At the same time, there are multiple solder joints and multiple electronic components on the printed circuit board, so multiple soldering is required

At the same time, soldering is used, because flux, solder, etc. will be introduced, so it is easy to cause the surface of the chip to be unclean, and additional cleaning steps are often required

[0004] Furthermore, the failure of electronic equipment is often caused by various problems in the soldering process, such as: the pressure welding is too heavy, causing the welding place to break; the pressure welding is too light or the surface of the chip is not clean, resulting in false welding Falling off; intermetallic compounds, such as Au-Al, may form Au at the soldering place 2 Al, AuAl, AuAl 2 、Au 4 Al, Au 5 Al, etc., have different lattice constants and expansion coefficients, and lower conductivity, resulting in reduced bonding strength and increased contact resistance, leading to device performance degradation or failure.

Images