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Lateral erosion, crack and cavity measurement slice manufacturing method

A manufacturing method and slicing technology, which are applied in the preparation of test samples, optical testing flaws/defects, sampling devices, etc., can solve the problems of blurred boundary lines of measurement slice graphics, etc.

Inactive Publication Date: 2019-06-04
深圳市仁创艺电子有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] The technical problem to be solved by the present invention is to provide a method for making measurement slices for side erosion, cracks, and cavities, which effectively solves the problem of fuzzy boundary lines of current measurement slice graphics.

Method used

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Examples

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Embodiment Construction

[0025] Below in conjunction with the examples, the present invention is further described, the following examples are illustrative, not limiting, and the protection scope of the present invention cannot be limited by the following examples.

[0026] A method for making side erosion, crack, and void measurement slices disclosed by the present invention: add the color filling link of the defect area in the existing defect slice process, and use the color of the filler to distinguish it from other materials (substrate, copper, solder mask color, Surface treatment, etc.) color, enhance the contrast of section defects, can quickly determine the defect boundary, and accurately measure the size of defects.

[0027] The process of the method for making slices of the present invention is as follows: slice sampling→rough grinding→color filling of defect areas→filling with crystal glue+fine grinding→measurement by metallographic microscope.

[0028] The core process of the slice making m...

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PUM

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Abstract

The invention discloses a lateral erosion, crack and cavity measurement slice manufacturing method. A current fuzzy measurement slice graph boundary problem is effectively solved. The method comprisesthe following steps of (1) slice sampling; (2) rough grinding; (3) polyester resin filling and fine grinding; and (4) metallographic microscope measurement, and also comprises the step of defect areacolor filling after the step (1) or the step (2), wherein the step of defect area color filling includes the following step of coating a defect area with a filler color to distinguish from other material colors so as to enhance a slice defect contrast ratio; and the other material colors include substrate, copper, and solder resist colors, and a surface processing color.

Description

technical field [0001] The invention relates to a defect detection technology of a printed circuit board, and is specifically used for making a measurement slice of a printed circuit board. Background technique [0002] At present, for printed circuit board ink, line side erosion, surface cracks, material voids and hole wall separation, slice sampling → rough grinding → pouring crystal glue + fine grinding → metallographic microscope is generally used to observe and measure by adjusting the filter image. [0003] Existing slice sampling rough grinding + pouring crystal glue + fine grinding + metallographic microscope adjusts the filter image observation and measurement method, mainly through the filter to adjust the image contrast, and the operation and adjustment of the filter takes a long time. [0004] At present, rough grinding of slice sampling + pouring crystal glue + fine grinding + metallographic microscope adjusts the filter image observation and measurement method,...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G01N1/06G01N1/28G01N21/95
Inventor 宋杰姜辉望马义伟
Owner 深圳市仁创艺电子有限公司
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