Wafer manufacturing method and wafer
A manufacturing method and wafer technology, which are used in manufacturing tools, semiconductor/solid-state device manufacturing, machine tools suitable for grinding workpiece planes, etc., can solve problems such as CMP accuracy decline and uneven film thickness, and achieve the effect of suppressing deviations
Inactive Publication Date: 2019-06-04
SUMCO CORP
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- Application Information
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Problems solved by technology
However, if there is waviness on the wafer, the accuracy of CMP will decrease and a layer with uneven film thickness will be formed.
Method used
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Experimental program
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Embodiment 1
[0092] {Example 1}
[0093] Except for the coating viscosity V of the curable resin and the chamfering roughness Ra of the chamfered part, each process (slicing process, chamfering process, resin sticking grinding process, etching process) was carried out under the same conditions as the above-mentioned Experiment 1. , mirror polishing process, cleaning process) to obtain 10 wafers. The coating viscosity V and chamfering roughness Ra are set so as to satisfy the above formula (1).
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Abstract
This wafer manufacturing method includes: a chamfering step for chamfering a wrapped wafer or a wafer cut out from a single crystal ingot; a resin layer forming step for forming a resin layer by applying a curable resin on one surface of the chamfered wafer; a first flat surface grinding step for grinding flat the other surface of the wafer by holding said one surface via the resin layer; a resinlayer removing step for removing the resin layer; and a second flat surface grinding step for grinding flat said one surface by holding the other surface, wherein, in the resin layer forming step, thecurable resin is applied so as to satisfy formula (1): Ra*V>=2*103, where Ra (nm) represents arithmetic average roughness of the chamfered part of the wafer, and V (mPa.s) represents viscosity of thecurable resin when being applied.
Description
technical field [0001] The invention relates to a method for manufacturing a wafer and the wafer. Background technique [0002] In a semiconductor device manufacturing process, multiple layers of metal or insulating films are formed on a wafer. Since the thickness uniformity of each layer formed on the wafer affects the performance of the device, planarization is performed by CMP (Chemical Mechanical Polishing) immediately after the formation of each layer. However, if there is waviness on the wafer, the accuracy of CMP will decrease, and a layer with non-uniform film thickness will be formed. Conventionally, the following techniques are known as techniques for flattening a waviness wafer. [0003] First, a curable resin is applied to one surface of the wafer, and the curable resin is flattened and cured to form a resin layer. Then, keep the flat surface of the resin layer, grind and planarize the other side of the wafer, remove the resin layer or not, keep the other side...
Claims
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IPC IPC(8): H01L21/304B24B7/04
CPCB24B7/04H01L21/304H01L21/02013H01L21/02024H01L21/02021H01L22/12H01L21/02118
Inventor 田中利幸又川敏
Owner SUMCO CORP