Electrodeposition copper recovery device and copper recovery production line using same

Abstract

The invention provides an electrodeposition copper recovery device and a copper recovery production line using the same. The copper recovery production line comprises the electrodeposition copper recovery device, wherein the electrodeposition copper recovery device comprises a cylinder body, a cathode, an anode, an upper cover and a circulating assembly; the cylinder body comprises a bottom plateand side plates; a reaction tank is defined by the bottom plate and the side plates; and a circulating assembly comprises an overflow box, an overflow pipe, a pump body and a spraying structure. Whenalkaline etching waste liquid is charged into the reaction tank for electrolysis, the alkaline etching waste liquid flows from the reaction tank to the overflow box, then, by the driving of the pump body, the alkaline etching waste liquid in the overflow box flows through the overflow pipe, a liquid inlet pipe and a spraying pipe, and finally the alkaline etching waste liquid is sprayed from sprayholes on the spray pipe to the bottom of the reaction tank, so that a closed loop for flowing the alkaline etching waste liquid is formed, the etching waste liquid at different heights in the reaction tank is fully mixed to make the concentration be more uniform, the efficiency of reducing copper ions on a cathode plate can be effectively improved, and the shapes of the reduced copper ions are more uniform.

Description

Technical field [0001] The invention belongs to the technical field of copper recovery, and in particular relates to an electrodeposited copper recovery device and a copper recovery production line using the same. Background technique [0002] The cleaning section of the production line for etching PCB boards, electroplating copper, electroless copper plating, etc. will discharge a large amount of copper-containing alkaline etching solution, and the etching solution contains a large amount of copper elements. If the copper-containing alkaline etching solution is directly discharged, copper resources will be wasted. It will also seriously pollute the environment. [0003] For copper-containing alkaline etching solutions, the electrolytic deposition method can be used to recover copper. However, in the prior art, the concentration of the alkaline etching waste solution in the electrodeposition device is uneven, which results in low efficiency when copper ions are reduced on the catho...

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Problems solved by technology

[0002] The cleaning section of production lines such as etching PCB boards, electroplating copper, and chemical copper plating will discharge a large amount of copper-containing alkaline etching solution, and the etching solution contains a large amount of copper elements. If the copper-containing alkaline etching solution is directly discharged, copper resources will be wasted. will seriously pollute the environment

[0003] For copper-containing alkaline etching solution, copper can be recovered by electrolytic deposition, but in the prior art, the concentration of alkaline etching waste liquid in the electrodeposition device is not uniform, which leads to low efficiency when copper ions are reduced on the cathode plate , the problem of uneven shape

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