Multi-chip integrated power amplification module internally matched with gallium nitride
A technology for integrating power and amplifying modules, applied in electrical components, electro-solid devices, circuits, etc., to solve problems such as inability to obtain high-power output
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[0030] Such as figure 1As shown, the internal matching gallium nitride multi-chip integrated power amplifier module includes input microstrip line 1, gallium nitride die chip 1 of model GDAH2P4A, power distribution microstrip line 3, and gallium nitride tube of model GDAH004A Core chip 2 4, gallium nitride die chip 3 of model GDAH004A 5, output microstrip line 6, DC bias circuit, impedance compensation circuit and base plate 7; one end of input microstrip line 1 is connected to the input signal, and the input microstrip The other end of the line 1 is connected to the input pin of the GaN die chip 12 through gold wire bonding, and the output pin of the GaN die chip 12 is respectively connected through the power distribution microstrip line 3 through gold wire bonding. The input pin of gallium nitride die chip 2 4 and the input pin of gallium nitride die chip 3 5, the output pin of gallium nitride die chip 2 4 and the output tube of gallium nitride die chip 3 5 The feet are all...
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