A semi-hole brazing and hot junction furnace for semiconductor laser to socket plate

Abstract

The invention belongs to the technical field of TO tube base production equipment and aims at providing a semiconductor laser unit TO tube base plate half hole brazing heat sintering furnace. According to the technical scheme, the furnace comprises a heat sintering furnace body; a feed inlet and a discharge outlet are formed in the two ends of the heat sintering furnace body correspondingly; workbenches are arranged at the two ends of the heat sintering furnace body correspondingly, a conveying belt is arranged on the workbenches and penetrates through the heat sintering furnace body, the conveying belt is a conveying wire mesh, cooling devices are arranged at the lower ends of the two workbenches correspondingly, and the conveying belt penetrates through the cooling devices; and accordingto the semiconductor laser unit TO tube base plate half hole brazing heat sintering furnace, by arranging the cooling devices, the conveying belt is cooled by means of the two segments of cooling devices, a long-time high temperature is prevented from oxidizing the conveying belt or causing high-temperature fatigue to the conveying belt, the good performance of the conveying belt is maintained, and a graphite positioning mould is driven to perform conveying stably.

Description

technical field [0001] The invention relates to the technical field of TO tube base production equipment, in particular to a semiconductor laser TO tube base plate half-hole brazing hot junction furnace. Background technique [0002] Semiconductor lasers have the advantages of small size, light weight, high efficiency, long life, easy modulation and low price, and have been widely used in industrial, medical and military fields, such as material processing, optical fiber communication, laser ranging, target indication, Laser guidance, laser radar, space optical communication, etc. Most of the existing semiconductor lasers are packaged in TO tube sockets, and the stability of the TO tube sockets directly affects the normal operation of the semiconductor lasers. [0003] The mass production of existing semiconductor laser TO tube sockets will utilize the sintering furnace. For example, the Chinese patent with the notification number CN101888057B discloses a method for prepari...

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Problems solved by technology

[0004] Combining the above patents, we can clearly understand the sintering process of the semiconductor laser TO tube base. The sintering furnace is generally divided into a preheating zone, a sintering zone, a cooling zone, and a cooling zone. It is necessary to ensure that the transmission belt drives the graphite positioning mold for sintering. The normal operation of the belt, and at the same time, the transmission belt is cooled in sections to prevent the high temperature from oxidizing the transmission belt and causing high temperature fatigue. However, the cooling device in the prior art generally uses water cooling. Although the water cooling method is easy to implement, the water cooling The water in the water is generally static, and the temperature of the water will rise after cooling the conveyor belt for a long time, so that the continuous cooling effect on the conveyor belt is not good, resulting in changes in the performance of the conveyor belt, and there may be breakage, which affects the entire TO Production of sockets

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