Unlock instant, AI-driven research and patent intelligence for your innovation.

Method and system for attaching cooling fin to chip

A heat sink and chip technology, applied in the manufacturing of electrical components, electrical solid-state devices, semiconductor/solid-state devices, etc., can solve the problems of reducing chip yield, chip surface damage, etc., achieving fast moving speed, improved dispensing speed, and improved Yield effect

Inactive Publication Date: 2019-06-14
NANTONG FUJITSU MICROELECTRONICS
View PDF4 Cites 1 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The inventor of the present application found in the long-term research process that the dispensing assembly is relatively close to the surface of the chip during the above-mentioned dispensing process, and the dispensing assembly is easy to touch the chip during the movement process, which will cause damage to the chip surface under the action of force, and then Reduce chip yield

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Method and system for attaching cooling fin to chip
  • Method and system for attaching cooling fin to chip
  • Method and system for attaching cooling fin to chip

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0027] The following will clearly and completely describe the technical solutions in the embodiments of the present application with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only some of the embodiments of the present application, not all of them. Based on the embodiments in the present application, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present application.

[0028] see Figure 1-Figure 2 , figure 1 It is a schematic flow chart of an embodiment of the method for mounting chips on heat sinks in the present application, figure 2 for figure 1 Step S101-step S103 is a structural schematic diagram of an implementation, the method includes:

[0029] S101 : Place the heat sink 10 on the first stage 12 , wherein the heat sink 10 includes a first surface 100 and a second surface 102 opposite to each other, an...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention discloses a method and a system for attaching a cooling fin to a chip; the method comprises the following steps that the cooling fin is placed on a first carrying table, wherein the cooling fin comprises a first surface and a second surface which are oppositely arranged, and the first surface of the cooling fin faces the first carrying table; a heat conduction adhesive is arranged onthe second surface of the cooling fin; and the chip is connected with the cooling fin through the heat conduction adhesive, wherein the chip is inversely arranged on a first substrate. By means of the mode, damage to the surface of the chip can be reduced when the cooling fin is attached.

Description

technical field [0001] The present application relates to the technical field of semiconductors, in particular to a method and system for attaching chips to heat sinks. Background technique [0002] Generally speaking, a chip will generate a lot of heat when it is running. If the cooling effect of the chip is not good, it is likely to affect the performance and service life of the chip. [0003] The traditional method is to apply thermal conductive glue on the surface of the chip with a dispensing component, and then press the heat sink on the surface of the chip. The heat sink can not only protect the chip, but also increase the heat dissipation area. [0004] The inventor of the present application has found in the long-term research process that the dispensing assembly is relatively close to the surface of the chip during the above-mentioned dispensing process, and the dispensing assembly is easy to touch the chip during the movement process, which will cause damage to th...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): H01L21/50H01L21/67
CPCH01L2224/73204H01L2224/73253H01L2924/16152
Inventor 卢海伦周锋吉祥
Owner NANTONG FUJITSU MICROELECTRONICS