Phase transition heat storage film, and prepration method thereof

A technology of phase change heat storage and phase change microcapsules, which is applied in the field of phase change heat storage film and its preparation, can solve problems such as leakage and phase change material precipitation, achieve stable high temperature aging performance, maintain stable performance parameters, eliminate Effect of liquid precipitation and leakage risk

Inactive Publication Date: 2019-06-18
SUZHOU TIANMAI THERMAL TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The technical problem to be solved by the present invention is to provide a phase change heat storage film to improve the defects of phase change material precipitation and leakage during the phase change cycle of the traditional phase change heat storage sheet, thereby improving the terminal performance of the phase change heat storage sheet. application stability

Method used

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  • Phase transition heat storage film, and prepration method thereof

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Embodiment 1

[0032] This embodiment discloses a phase-change heat storage film, which includes a lower adhesive film, a heat storage functional layer, and an upper adhesive film that are stacked sequentially from bottom to top, and the lower surfaces of the upper adhesive film and the lower adhesive film are coated with Has a pressure sensitive adhesive layer. Wherein, the thickness of the heat storage functional layer is 0.2mm, and the thickness of the pressure-sensitive adhesive layer is 50um.

[0033] The formula of the heat storage functional layer of this embodiment includes the following components by mass percentage: 10% of matrix resin, 31% of phase change microcapsules, 58% of organic solvent, 0.5% of dispersant, 0.2% of defoamer, and 0.3% of anti-settling agent %.

[0034] After the above-mentioned components are taken according to their respective proportions, the steps to prepare the phase change heat storage film are as follows:

[0035] (1) First, the base resin (polyester ...

Embodiment 2

[0042] This embodiment discloses a phase-change heat storage film, which includes a lower adhesive film, a heat storage functional layer, and an upper adhesive film that are stacked sequentially from bottom to top, and the lower surfaces of the upper adhesive film and the lower adhesive film are coated with Has a pressure sensitive adhesive layer. Wherein, the thickness of the heat storage functional layer is 0.3mm, and the thickness of the pressure-sensitive adhesive layer is 10um.

[0043] The formula of the heat storage functional layer of this embodiment includes the following components by mass percentage: matrix resin 8%, phase change microcapsule 24%, organic solvent 67.2%, dispersant 0.4%, defoamer 0.2%, anti-settling agent 0.2% %.

[0044] After the above-mentioned components are taken according to their respective proportions, the steps to prepare the phase change heat storage film are as follows:

[0045] (1) First, heat up the matrix resin (styrene-butadiene-styr...

Embodiment 3

[0052] This embodiment discloses a phase-change heat storage film, which includes a lower adhesive film, a heat storage functional layer, and an upper adhesive film that are stacked sequentially from bottom to top, and the lower surfaces of the upper adhesive film and the lower adhesive film are coated with Has a pressure sensitive adhesive layer. Wherein, the thickness of the heat storage functional layer is 0.5mm, and the thickness of the pressure-sensitive adhesive layer is 30um.

[0053]The formula of the heat storage functional layer of this embodiment includes the following components in mass percentage: matrix resin 5%, phase change microcapsule 12%, organic solvent 82%, dispersant 0.2%, defoamer 0.4%, anti-settling agent 0.4% %.

[0054] After the above-mentioned components are taken according to their respective proportions, the steps to prepare the phase change heat storage film are as follows:

[0055] (1) First, heat up the base resin (polyester resin) to 50°C an...

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Abstract

The invention discloses a phase transition heat storage film. The phase transition heat storage film comprises a lower rubber film, a heat storage functional layer, and an upper rubber film which arelaminated successively; the lower surface of the upper rubber film, and the lower surface of the lower rubber film are coated with pressure sensitive adhesive layers; the heat storage functional layercomprises matrix resin, and phase transition microcapsules distributed in the matrix resin; the matrix resin is a thermoplastic resin or a thermosetting resin. The invention also discloses a preparation method of the phase transition heat storage film. According to the phase transition heat storage film, defects in the prior art that in phase transition circulation of conventional phase transition heat storage film, phase transition material precipitate and leakage are caused; and phase transition heat storage sheet material terminal application stability is improved.

Description

technical field [0001] The invention relates to the technical field of phase-change heat-conducting materials, in particular to a phase-change heat storage film and a preparation method thereof. Background technique [0002] As an important latent heat storage material, the organic phase change composite heat storage material has the advantages of high phase change heat storage density, small temperature change during the phase change process, stable chemical properties, and high reuse rate; it has been widely used It is used in the fields of spacecraft thermal control, solar thermal utilization, building energy saving and chip cooling. As the design and structure of electronic products become thinner and more highly integrated, the phase-change heat storage materials used in the heat dissipation solution inside the device are also facing the requirements of step difference due to thinness and high integration. [0003] In the prior art, Chinese patent document CN106753254A...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09K5/06
Inventor 刘永强畅同晨刘晓阳
Owner SUZHOU TIANMAI THERMAL TECH
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