IDF lead frame-based semiconductor product package method

Abstract

The invention discloses an IDF lead frame-based semiconductor product package method. The IDF lead frame comprise N lines of chip groups, wherein N is more than or equal to 1, two adjacent lines of chip groups are connected by first connection ribs, each line of chip group comprises two chip units, each chip unit comprises a patch region and a pin region, pins of the pin regions of the two chip units are arranged in a staggered way, adjacent pins are connected by a corresponding second connection rib, an invisible pin with a preset width is arranged between adjacent pins of each chip unit, a first end of the invisible pin is fixedly arranged on the second connection rib, a second end of the invisible pin extends to the patch region of the chip unit, and a preset gap is reserved between thesecond end of the invisible pin and an edge of the patch region. The invisible pin and the connection ribs of the lead frame are removed in a package rib cutting process, the problem that a die sealing material cannot be filled between adjacent pins and the patch region of the chip unit during die sealing is solved, and the design accuracy of a package die is also greatly reduced.

Description

technical field [0001] The present invention relates to a lead frame of a semiconductor product, in particular to a packaging method of a semiconductor product based on an IDF (full name: Inter-Digitated leadframe, interdigitated lead frame) lead frame. Background technique [0002] The IDF lead frame provided by the prior art improves the production efficiency of pin-separated device products by rationally designing the staggered arrangement of chip patch areas and pin areas. However, due to the relatively large gaps between the staggered pins, when the prior art pin separation device products are packaged, bosses need to be provided on the mold so that the bosses are embedded in the ribs and patch areas of the lead frame. The empty space between the pins in the area between to prevent the resin from being filled into the empty space when filling. However, due to the different sizes of the pins of lead frames of different specifications, the size of the blank space between...

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Problems solved by technology

[0003] In order to overcome the deficiencies in the prior art, the object of the present invention is to provide a packaging method based on an improved IDF lead frame, which can solve the problems of complex mold design and poor compatibility of traditional lead frames during molding.

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