Manufacturing method of circuit board being capable of achieving high-density interconnection

Abstract

The invention relates to the technical field of printed circuit boards, and in particular relates to a manufacturing method of a circuit board being capable of achieving high-density interconnection.After patterns are electroplated on a copper layer and a stannum layer, stannum is partially removed by laser and alkaline etching is performed, the stannum is removed to form a metallized sub-hole, the copper layer in the hole wall is separated by a substrate layer to form mutually independent parts, so that interlayer interconnection of different networks can be achieved, the electrical connection function of multiple micropores is achieved in the metallized sub-hole manufactured by a mechanical through hole, and thus the high-density interconnection can be achieved without using the micropore technology. Therefore, the invention provides the high-density interconnection circuit board of which the interlayer high-density interconnection is achieved via the metallized sub-hole, and a manufacturing method that can manufacture the high-density interconnection circuit board only via the mechanical through hole technology without using the micropore technology; the through hole technologyis used, so that multiple times of laser drilling, porefilling and electroplating and pressing are not needed, the technical process is relatively simpler, and the manufacturing difficulty and the manufacturing cost are greatly reduced.

Description

technical field [0001] The invention relates to the technical field of printed circuit boards, in particular to a method for manufacturing a circuit board realizing high-density interconnection. Background technique [0002] With the continuous improvement of the integration of electronic systems, circuit boards are becoming more and more miniaturized, thinner and integrated, so it is inevitable that the design density of circuit boards will become higher and higher, and the application of high-density interconnection circuit boards will become more and more Many, such as mobile phones of consumer electronics. As the size of the mobile phone battery is increasing, the space for increasing the mobile phone circuit board is very small, but the performance of the mobile phone needs to be improved to meet the increasingly multi-functional and high-speed development. Therefore, when designing the circuit board, increase the number of layers and reduce the Line width, line spacin...

AI Technical Summary

Problems solved by technology

[0004] The present invention aims at the problem that the existing high-density interconnection circuit board adopts the microhole technology to realize the interlayer electrical connection, which requires multiple laser drilling, hole filling, electroplating and pressing processes, the process is complicated and the manufacturing cost is high. A method for making a circuit board capable of achieving high-density interconnection without using microvia technology by realizing the electrical connection function of multiple microvias in one mechanical through hole

Images