Method and device for predicting temperature rise of contact points of electrical equipment
A technology of power equipment and contact points, which is applied in the field of power systems and can solve problems affecting the life of switch cabinets and other issues
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Embodiment 1
[0056] This embodiment provides a method for predicting the temperature rise of the contact point of the switch cabinet, and the execution subject is a device for predicting the temperature rise of the contact point of the switch cabinet. The device can be integrated in a temperature measuring sensor, a computer or a relay, or can be set separately, which will not be repeated here.
[0057] Such as figure 1 As shown, is a schematic flow chart of the method for predicting the temperature rise of the contact point of the switchgear according to this embodiment. The method includes:
[0058] Step 101 , acquiring a first temperature rise of a contact point of a switch cabinet at the beginning of an initial sampling period and a second temperature rise at the end of an initial sampling period, the contact point being a contact position of at least two components of the switch cabinet.
[0059] The initial sampling period refers to the sampling period corresponding to the first te...
Embodiment 2
[0073] This embodiment provides a further supplementary description of the method for predicting the temperature rise of the contact point of the switchgear in the first embodiment. Such as figure 2 As shown, is a schematic flow chart of the method for predicting the temperature rise of the contact point of the switchgear according to this embodiment. The method includes:
[0074] Step 201 , acquiring a first temperature rise of a contact point of a switch cabinet at the beginning of an initial sampling period and a second temperature rise at the end of an initial sampling period, the contact point being a contact position of at least two components of the switch cabinet.
[0075] This step is consistent with step 101 and will not be repeated here.
[0076] Step 202, obtaining a time constant of a first-order inertial system of a switch cabinet.
[0077] This step is consistent with step 102 and will not be repeated here.
[0078] Step 203, according to the first temperat...
Embodiment 3
[0091] This embodiment provides a device for predicting the temperature rise of the contact point of the switchgear, which is used to implement the method for predicting the temperature rise of the contact point of the switchgear in the first embodiment.
[0092] Such as image 3Shown is a schematic structural diagram of the device for predicting the temperature rise of the contact point of the switchgear according to this embodiment. The device includes a first acquisition unit 301 , a second acquisition unit 302 and a prediction unit 303 .
[0093] Wherein, the first acquisition unit 301 is used to acquire the first temperature rise of a contact point of the switch cabinet at the beginning of an initial sampling period and the second temperature rise at the end, the contact point being the contact position of at least two components of the switch cabinet ; The first determination unit 302 is used to obtain the time constant of the first-order inertial system of a switch cab...
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