Sealing ring dynamic cleaning device for copper foil electrolytic production

A cleaning device and sealing ring technology, which is applied to the cleaning method using liquid, the cleaning method using tools, the electrolysis process, etc., can solve the problems of polluting the sealing ring, affecting the electrolytic production of copper foil, etc., and achieve good cleaning effect.

Active Publication Date: 2019-06-28
赣州逸豪新材料股份有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Solved the problem that the sealing ring is easy to adhere to the electrolyte liquid in the production process of electrolytic copper foil, which will pollute the sealing ring and finally affect the electrolytic production of copper foil

Method used

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  • Sealing ring dynamic cleaning device for copper foil electrolytic production
  • Sealing ring dynamic cleaning device for copper foil electrolytic production
  • Sealing ring dynamic cleaning device for copper foil electrolytic production

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Embodiment Construction

[0031] A number of embodiments of the present invention will be disclosed in the following figures. For the sake of clarity, many practical details will be described together in the following description. It should be understood, however, that these practical details should not be used to limit the invention. That is, in some embodiments of the invention, these practical details are not necessary. In addition, for the sake of simplifying the drawings, some well-known and commonly used structures and components will be shown in a simple schematic manner in the drawings.

[0032] In addition, in the present invention, descriptions such as "first", "second" and so on are used for description purposes only, and do not refer to the meaning of order or sequence, nor are they used to limit the present invention, but are only for the purpose of distinguishing the following The components or operations described by the same technical terms are only used, but should not be understood a...

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Abstract

The invention relates to the technical field of electrolytic copper foil production equipment, in particular to a sealing ring dynamic cleaning device for electrolytic copper foil production. The sealing ring dynamic cleaning device for electrolytic copper foil production comprises a guide wheel assembly, a cleaning device and a workbench, wherein a plurality of guide sealing rings are arranged onthe guide wheel assembly; the two sides of the workbench are each provided with a cleaning water tank; the two sides of the workbench are provided with pressing devices for pressing and attaching thesealing rings on a cathode roller; the two sides of the workbench are further provided with driving assemblies for driving the pressing devices to rotate; the guide wheel assembly is arranged at a side portion of each pressing device; a leading-in wheel is arranged on one side above each cleaning water tank; a leading-out wheel is arranged on the other side of each cleaning water tank; the cleaning device comprises cleaning components and horizontal moving components, wherein the horizontal moving component is arranged on the side wall of each cleaning water tank; an output end of each horizontal moving component is vertically provided with a mounting rod; the cleaning component is mounted on each mounting rod; and an output end of each cleaning component extends into each cleaning watertank. According to the sealing ring dynamic cleaning device, the sealing rings are cleaned efficiently.

Description

technical field [0001] The invention relates to the technical field of electrolytic copper foil production equipment, in particular to a dynamic cleaning device for sealing rings used in the electrolytic production of copper foil. Background technique [0002] Copper foil is an important material for the manufacture of copper clad laminates and printed circuit boards. In the rapid development of today's electronic information industry, electrolytic copper foil is called the "neural network" of electronic signal and power transmission. Copper foil has low surface oxygen characteristics, can be attached to various substrates, such as metals, insulating materials, etc., and has a wide temperature range. Mainly used in electromagnetic shielding and antistatic, the conductive copper foil is placed on the substrate surface, combined with the metal substrate, it has excellent conductivity and provides the effect of electromagnetic shielding. It can be divided into: self-adhesive ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B08B3/10B08B1/02B08B13/00C25D1/04B08B1/20
Inventor 张剑萌熊以俊薛国元陆峰付赞辉崔建华
Owner 赣州逸豪新材料股份有限公司
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