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A kind of polyimide composite resin with low dielectric constant and its preparation method and application

A technology of polyimide resin and low dielectric constant, which is applied in the field of preparation of polyimide composite resin, can solve the problems of low dipole moment and dielectric constant reduction, and achieve the goal of improving flexibility and reducing dielectric constant Effect

Active Publication Date: 2021-06-01
HANGZHOU FIRST ELECTRONIC MATERIAL CO LTD
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  • Abstract
  • Description
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AI Technical Summary

Problems solved by technology

However, on the molecular chain of polymethylimide, it is composed of imine groups instead of imide rings; there is no carbonyl group, so it has a lower dipole moment and a relatively lower dielectric constant

Method used

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  • A kind of polyimide composite resin with low dielectric constant and its preparation method and application
  • A kind of polyimide composite resin with low dielectric constant and its preparation method and application
  • A kind of polyimide composite resin with low dielectric constant and its preparation method and application

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Embodiment 1-20

[0081][Polyimide Composite Resin A-T] was prepared according to the amount of raw material in Table 1 and the following experimental steps:

[0082]In a nitrogen atmosphere, in a three-port flask, the quantitative diamine represented by Table 1 was dissolved in 40 g of NMP while stirring while stirring, the total mass percentage of the amine compound was 5% -13. %. Then, the quantitative dimethylhydraldehyde compound shown in Table 1 was added, and the temperature of the solution was controlled in a nitrogen atmosphere of 0 to 50 ° C, and the reaction was 4-24 h. The quantification of quantitative tetrachlinic acid dihydride compound shown in Table 1 was added three times in solution. Each addition amount accounted for 60%, 30%, 10% of total weight; continued to react in a nitrogen atmosphere of 4-48 h, solution temperature Controlled at 0-50 ° C. The precursor solution of the polyimide composite resin was finally obtained.

[0083]The precursor solution of the polyimide composite resin w...

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Abstract

The invention discloses a low dielectric constant polyimide composite resin and its preparation method and application, which is composed of polyimide resin units and polymethylimide resin units in the form of blending and copolymerization; in the copolymer structure Form a network structure and increase the gap between molecular chains. The dipole moment of the polyimide molecular chain is reduced through the introduction of the polymethylimide resin; at the same time, the fluorine-containing monomer is used in the polymerization to jointly reduce the dielectric constant of the polyimide composite resin. Design flexible polyimide molecular chain segments through monomer types to balance the highly rigid polyimide molecular chains, so that the rigidity-flexibility of molecular chain segments in the final polyimide composite resin can reach a better balance point , not only to ensure that the polyimide composite resin has good mechanical properties, but also to ensure that the polyimide composite resin has a controllable linear thermal expansion coefficient, so that the polyimide composite resin can be used in flexible copper clad laminates, photosensitive cover films, and circuits. Board products have good application prospects.

Description

Technical field[0001]The present invention relates to the preparation of a polyimide composite resin, and in particular, there is a polyimide composite resin co-mixed from polyimide and polyamide, which has a characteristic of low dielectric constant. There is a good application in the field of high frequency high speed lines and electronic materials. The polyimide composite resin of the present invention and the corresponding flexible coat copper are suitable for high frequency transmission flexible printed circuit board, high-frequency electronic device insulating substrate, high fidelity signal transmission, and various electronic electrical products.Background technique[0002]Polyimide resin is a high performance engineering plastic because of its inherent heat resistance, heat resistance, chemical stability, and excellent mechanical properties, cold and hot impact, long-term use temperature range from -50 ° C to 250 ° C, widely used in industrial products. Polyimide has excellen...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08G73/10C08G12/08C08J5/18G03F7/004H05K1/03C08L79/08
Inventor 周慧翁建东李营俞仁杰章陈萍周光大林建华
Owner HANGZHOU FIRST ELECTRONIC MATERIAL CO LTD
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